Crystal Oscillator Package Thinning via Same-Plane Metal Layer
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Solution Overview
Problem
Existing crystal oscillator packages face challenges in miniaturization due to the thickness of stacked ceramic layers and misalignment issues during assembly, which hinder the thinning of the package body and efficient mounting of electronic components.
Innovation Solution
A package design featuring a metal layer and electrode pads formed on the front surface of an insulating material with a metal frame, allowing for the same-plane positioning of these components and a cavity opening, enabling thinning and miniaturization while preventing brazing material contact with electrodes through grooves.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If three layers of ceramic plates are stacked to form a container body, then the crystal oscillator can be mounted on the front surface and an IC chip can be mounted inside a cavity, but the thickness of the whole container body becomes thick
Solution Approach 1:
The package body is divided into two separate layers: a first insulating layer forming the front surface with metal layer and electrode pads, and a second insulating layer forming the back surface with cavity. This segmentation allows each layer to be optimized independently, reducing the overall thickness while maintaining both mounting capabilities.
Solution Approach 2:
The invention transitions from a three-layer stacked structure to a two-layer structure by repositioning elements in the planar dimension. The metal layer, electrode pads, and cavity opening are all positioned in the same plane on the front surface, eliminating the need for a separate middle layer and reducing thickness in the vertical dimension.
2Ease of manufacture
If the seal ring is joined to the ceramic plate or lamination misalignment occurs between ceramic plates, then the assembly can be completed, but space for bonding the crystal piece becomes difficult to obtain
Solution Approach 1:
The metal layer is formed on the front surface of the first insulating layer before assembling the package body. This preliminary formation ensures that the electrode pads and metal layer are positioned accurately in advance, providing sufficient bonding space for the crystal oscillator regardless of subsequent assembly variations or misalignments.
Solution Approach 2:
The metal layer acts as an intermediary element between the insulating layers and the crystal oscillator. By forming this metal layer with electrode pads in advance on the front surface, it provides a stable bonding interface that compensates for potential misalignments in the layered structure, ensuring adequate bonding space is maintained.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for the thinning of the package body, easy alignment of components, and prevention of malfunctions, achieving effective surface mounting and miniaturization of crystal oscillators and electronic components.
Implementation Method 1
a metal layer brazed with a metal frame to make a seal
Data Source
AI summary
Embodiments of the present packages comprise a package body that is made of an insulating material, has a front surface and a back surface, and has a rectangular shape in plan view, a metal layer that is formed along a peripheral portion of the front surface of the package body and that has a frame shape in plan view, a metal frame that is joined to the metal layer with a brazing material and has a frame shape in plan view. a pair of electrode pads that are formed on the front surface of the package body surrounded by the metal layer and configured to mount a crystal oscillator, and an opening portion of a cavity opened in a position that excludes the pair of electrode pads, wherein the metal layer, the pair of electrode pads, and the opening portion of the cavity are positioned in the same plane.