Crystal Vibration Device Thermal Management
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Solution Overview
Problem
Existing crystal vibration devices face issues with sudden temperature changes in IC chips due to rapid heat conduction, leading to frequency drift, as the heat conduction paths are not effectively managed to prevent temperature fluctuations between the IC chip and the crystal vibrator.
Innovation Solution
A crystal vibration device design featuring a mounting board with specific connection electrode configurations, including first and second portions with different dimensions, and the use of resist insulating materials to slow down heat transfer, making it difficult to transfer heat to the temperature-sensitive elements and crystal vibrator, thereby stabilizing the temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the width of the wiring pattern from the terminal to the electrode land on which the IC chip is mounted is increased, then the heat conduction efficiency is improved, but the time taken until heat reaches the IC chip becomes short, causing sudden temperature changes
Solution Approach 1:
The wiring pattern width is varied at different locations: wider near the terminal for efficient heat conduction, and narrower near the IC chip to slow down heat arrival. This local variation in width optimizes both heat conduction efficiency and temperature stability.
Solution Approach 2:
The wiring pattern includes a portion that extends in a direction other than the straight line from terminal to IC chip, creating a longer heat conduction path. This dimensional change allows heat to be conducted more efficiently overall while delaying its arrival at the IC chip.
2Stability of the object's composition
If the distance of the heat conduction path from the terminal to the IC chip is made equal to the distance from the terminal to the crystal vibrator, then the heat conduction balance is improved, but the configuration that makes it difficult for heat to reach the IC chip is not provided, causing sudden temperature changes
Solution Approach 1:
The wiring pattern width is specifically reduced in the portion extending toward the IC chip, creating local resistance to heat flow. This local quality change ensures balanced heat conduction paths while preventing sudden temperature changes at the IC chip.
3Loss of time
If the heat conduction path from the terminal to the IC chip is lengthened, then the time taken until heat reaches the IC chip is lengthened, but the structure other than the length of the heat conduction path is not specified, failing to adequately prevent sudden temperature changes
Solution Approach 1:
The wiring pattern width is strategically varied: wider in some portions for efficient heat conduction and narrower in critical portions to delay heat arrival at the IC chip. This local quality control provides both time delay and temperature stability.
Solution Approach 2:
The wiring pattern extends in non-linear directions, increasing the heat conduction path length without simply extending the straight-line distance. This dimensional approach adequately prevents sudden temperature changes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively inhibits sudden temperature changes in the IC chip and crystal vibrator, reducing frequency drift and enhancing temperature correction stability by slowing down heat transfer and allowing for better heat dissipation, thus improving the device's thermal management.
Implementation Method 1
By heat being conducted from a surrounding electronic component or the like through a terminal and the like to an IC chip
Implementation Method 2
resist insulating material is on the upper surface of the mounting board and crosses over at least a portion of the first portion of the at least one connection electrode
Data Source
AI summary
Provided is a crystal vibration device in which it is difficult to transfer heat to a temperature-sensitive element and a crystal vibrator. A crystal vibration device 1 according to the present invention includes: a mounting board 2; connection electrodes 4a and 4b extending on a side surface of the mounting board 2 and reaching an upper surface 2a of the mounting board 2; a first package material 9 provided on the mounting board 2; a crystal vibrator 7 provided on an upper surface 9a of the first package material 9; and a temperature-sensitive element 14 mounted on a lower surface 9b of the first package material 9. Each of the connection electrodes 4a and 4b has a first portion 4A located on the upper surface 2a of the mounting board 2. When a direction in which the first portion 4A of each of the connection electrodes 4a and 4b extends toward an electrode land 5a or 5b is defined as a first direction and a direction orthogonal to the first direction is defined as a second direction in a plan view, a dimension, along the second direction, of a portion of the first portion 4A of each of the connection electrodes 4a and 4b is smaller than a dimension, along the second direction, of a remaining portion of each of the connection electrodes 4a and 4b.