3D Tile Architecture Using Crystalline Interposers for RF Signal Integrity
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Solution Overview
Problem
Existing 3D packaging technologies for heterogeneous integrated circuits face challenges in achieving high-frequency performance, size reduction, and yield due to impedance issues and incompatibilities between different circuit types and manufacturing processes, especially as frequencies exceed 20 GHz.
Innovation Solution
A 3D tile architecture using high-precision microelectronics fabrication techniques with crystalline interposers and vertical interconnects, enabling precise impedance control and integration of sensitive circuits, and allowing for the use of Known-Good-Die (KGD) MMIC chips with various attachment options, forming a compact and high-performance assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through-wafer vias are used to connect dies in 3D stacking, then electrical interconnection is achieved, but resistivity of the interposer increases loss to RF signals at microwave frequencies
Solution Approach 1:
The patent changes the material parameter of the interposer from conventional silicon to low-loss dielectric materials such as quartz, alumina, or PTFE. This material substitution fundamentally alters the resistivity and dielectric properties, enabling RF signals to pass through the interposer with minimal loss while maintaining the through-wafer via interconnection structure.
2Volume of moving object
If diverse circuit elements are integrated on a single wafer, then assembly size is reduced, but incompatible manufacturing processes prevent heterogeneous circuit functionality
Solution Approach 1:
The patent segments the integration process into two distinct phases: (1) fabrication of diverse circuit elements on separate wafers using their respective optimized manufacturing processes, and (2) subsequent bonding of these pre-fabricated circuits onto a common low-loss dielectric substrate. This segmentation allows each circuit type to be manufactured using its ideal process while achieving final integration on a unified platform that supports RF frequencies up to 300 GHz.
3Ease of manufacture
If Printed Wiring Boards are used for RF transitions, then packaging is simplified, but large via diameter and spacing cause high loss and narrow bandwidth
Solution Approach 1:
The patent changes the interposer material from conventional PCB substrate to low-loss dielectric materials with dramatically reduced loss tangents. This material substitution enables the fabrication of much smaller via diameters and tighter via spacing, reducing RF transition loss and expanding bandwidth while maintaining packaging simplicity through the same interposer-based architecture.
Data Source
AI summary
A system and method for vertically integrating heterogeneous devices into a 3D tile architecture are disclosed. The system uses high precision microelectronics fabrication techniques and known-good-die to achieve high yield to integrate devices to process radio frequency signals at microwave frequencies of approximately 300 MHz to 300 GHz and above. The inventive architecture is based on a high density of small diameter vias to manage the integrity of electrical interconnects and simplify electrical routing.