Crystalline Sealing Composition for Flowable Electronic Component Molding
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Solution Overview
Problem
Existing sealing technologies for electrical and electronic components face issues with low productivity, poor handleability, and limited thermal conductivity, particularly in the use of liquid epoxy resins and thermally conductive resins, which affect the molding process and product quality.
Innovation Solution
A crystalline radical polymerizable composition comprising crystalline unsaturated polyester, epoxy (meth) acrylate, urethane (meth) acrylate, polyester (meth) acrylate, polyether (meth) acrylate, and radical polymerizable monomers, with a melting point of 30 to 150°C, low melt viscosity, and high thermal conductivity, combined with an inorganic filler and a radical polymerization initiator, to enhance flowability and handleability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If liquid epoxy resin is used for sealing, then adhesion to resin substrate or metal and mechanical strength are improved, but productivity is reduced due to complex molding processes
Solution Approach 1:
The patent changes the physical state parameter of the resin from liquid (epoxy resin) to solid crystalline form (radical polymerizable composition). This allows the resin to be processed in granular form through injection molding, significantly improving productivity while maintaining sealing performance. The crystalline structure melts during molding to provide adequate flowability, then solidifies to form the seal.
Solution Approach 2:
The patent replaces the chemical bonding mechanism of epoxy resin with the physical melting and solidification mechanism of crystalline radical polymerizable composition. This substitution enables the use of standard injection molding equipment and processes, improving productivity without sacrificing adhesion or mechanical strength.
2Temperature
If thermosetting resin is used for high temperature resistance, then heat resistance is improved, but handleability and flowability deteriorate due to high viscosity
Solution Approach 1:
The patent changes the temperature parameter at which the resin transitions from solid to liquid state. The crystalline radical polymerizable composition is designed to melt at a specific temperature range during the molding process, providing excellent flowability and handleability when molten, while maintaining heat resistance in the solid state for the final sealed component.
3Reliability
If inorganic filler is added to resin material, then thermal conductivity is improved, but manufacturing complexity increases
Solution Approach 1:
The patent creates a composite material system by combining crystalline radical polymerizable compound with inorganic filler particles. This composite structure provides enhanced thermal conductivity for heat dissipation while the crystalline matrix maintains processability through injection molding, avoiding the complexity issues associated with traditional thermosetting resin formulations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high productivity, excellent handleability, and thermal conductivity, enabling efficient molding of electrical and electronic components with improved product quality and reduced molding defects.
Implementation Method 1
a crystalline radical polymerizable composition for an electrical and electronic component, characterized by comprising at least a crystalline radical polymerizable compound
Implementation Method 2
The crystalline radical polymerizable composition for an electrical and electronic component has a melting point of 30 to 150°C
Implementation Method 3
a radical polymerization initiator
Data Source
AI summary
[Problems] An object of the present invention is to provide a crystalline radical polymerizable composition which is excellent in flowability and is easy to handle. [Solution means] The crystalline radical polymerizable composition for sealing electrical and electronic component according to the present invention is characterized by comprising at least a crystalline radical polymerizable compound, an inorganic filler, a silane coupling agent, and a radical polymerization initiator. In addition, in a preferred embodiment of the crystalline radical polymerizable composition for sealing electrical and electronic component according to the present invention, the crystalline radical polymerizable compound is characterized by comprising one or more selected from unsaturated polyester, epoxy (meth) acrylate, urethane (meth) acrylate, polyester (meth) acrylate, -polyether (meth) acrylate, radical polymerizable monomer and radical polymerizable polymer.