Solid-State Imaging Package Layout for Flare Suppression
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Solution Overview
Problem
Solid-state imaging devices configured as chip size packages (CSP) experience flare phenomena due to light reflection and diffraction, leading to deteriorated picture quality.
Innovation Solution
A solid-state imaging device with a semiconductor substrate, on-chip lenses, a resin layer, and a glass substrate, where the resin layer covers the on-chip lenses and the glass substrate is positioned separately, creating an air gap to reduce flare by altering the light reflection path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a solid-state imaging device is configured as a chip size package (CSP) type, then the size and thickness of the camera are decreased, but a flare phenomenon occurs due to reflection and diffraction of light, causing picture quality to deteriorate
Solution Approach 1:
A resin layer is introduced as an intermediary substance between the semiconductor substrate and the surrounding environment. This resin layer has a refractive index that is optimized to reduce light reflection and diffraction at the interfaces, thereby suppressing the flare phenomenon while maintaining the compact CSP structure. The resin layer acts as an optical mediator that improves light transmission without increasing the overall device size.
Solution Approach 2:
The refractive index of the resin layer is specifically optimized and adjusted to match the optical characteristics of the semiconductor substrate and on-chip lenses. By changing the refractive index parameter of the resin layer, the patent achieves reduced light reflection and diffraction, thereby suppressing flare while maintaining the compact camera structure. This parameter optimization allows the device to maintain small size while improving optical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces flare and improves picture quality by minimizing the flight distance of diffracted light, thereby curbing picture quality deterioration.
Implementation Method 1
a flare phenomenon occurs due to reflection and diffraction of light in the imaging device
Implementation Method 2
a flare phenomenon occurs due to reflection and diffraction of light in the imaging device
Implementation Method 3
creating an air gap to reduce flare by altering the light reflection path
Data Source
AI summary
Picture quality deterioration is curbed. A solid-state imaging device according to an embodiment includes: a semiconductor substrate (131) including a light-receiving element; an on-chip lens (132) disposed on a first surface of the semiconductor substrate; a resin layer (133) covering the on-chip lens; and a glass substrate (134) disposed on the side of the first surface of the semiconductor substrate separately from the resin layer.