Chip Scale LED with Integrated Conductive Layer for Edge-Lit Backlight
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Solution Overview
Problem
Existing light-emitting diode (LED) backlight modules, particularly edge-lit types, face challenges in achieving a compact form factor and efficient light distribution for small devices like mobile phones and wearable technology, as they require a side-view LED package that can be mounted directly on a printed circuit board without the need for submounts or leadframes.
Innovation Solution
A light-emitting device with a chip scale package (CSP) design, featuring a light-emitting chip surrounded by a wavelength conversion layer and reflective layers, is mounted on a printed circuit board using solder, allowing for a compact form factor and efficient light emission parallel to the board surface, which is then directed into a light guide plate for uniform illumination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a side-view LED package is used to emit light parallel to the printed circuit board for edge-lit backlight, then the light-emitting direction is suitable for compact devices, but the device complexity increases due to the need for specialized mounting without submounts or leadframes
Solution Approach 1:
The patent merges the LED chip, conductive layers, and reflective layers into a single integrated light-emitting device structure. The conductive layer is formed directly on the internal electrode layer of the LED chip, eliminating the need for separate submounts or leadframes. This integration reduces the number of components and simplifies the mounting structure while maintaining the side-view light-emitting capability for edge-lit backlight applications.
Solution Approach 2:
The patent changes the light-emitting direction from the conventional vertical orientation to a parallel orientation relative to the printed circuit board. This dimensional change in light emission allows the LED to function in edge-lit backlight configurations, enabling compact device designs while using standard PCB mounting processes.
2Volume of moving object
If a chip scale package design is used to reduce the size of the light-emitting device, then the volume is reduced for compact devices, but the manufacturing precision requirements increase
Solution Approach 1:
The conductive layer is formed directly on the internal electrode layer of the LED chip during the chip fabrication process, before the chip is mounted on the PCB. This preliminary formation of the conductive structure ensures precise alignment and electrical connection without requiring high-precision alignment during the mounting process, thus reducing manufacturing complexity while achieving compact dimensions.
3Strength
If solder is used to mount the light-emitting device on the printed circuit board, then the bond strength is improved, but the manufacturing process complexity increases
Solution Approach 1:
The light-emitting device is designed with a universal mounting structure that can be directly soldered to the PCB using standard PCB mounting processes. The conductive layer serves multiple functions: providing electrical connection, mechanical support, and heat dissipation. This multi-functionality allows the use of conventional soldering techniques without requiring specialized mounting equipment or processes, thus maintaining ease of manufacture while achieving strong bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables a compact and reliable edge-lit backlight module suitable for small devices, enhancing light distribution and improving the bond strength between the LED and the printed circuit board, thus enhancing the reliability of the display module.
Implementation Method 1
a conductive layer, wherein the conductive layer has a first portion formed on the internal electrode layer and overlapping the light body in a first direction, and a second portion overlapping the light body in a second direction
Implementation Method 2
a light body having an internal electrode layer
Implementation Method 3
The light-emitting diodes (LEDs) have the characteristics of low power consumption, long operational life, small volume, quick response and stable opto-electrical property of emitted light
Implementation Method 4
A light-emitting device with a chip scale package (CSP) design, featuring a light-emitting chip surrounded by a wavelength conversion layer
Implementation Method 5
reflective layers, is mounted on a printed circuit board using solder, allowing for a compact form factor and efficient light emission parallel to the board surface
Implementation Method 6
mounted on a printed circuit board using solder, improving the bond strength between the LED and the printed circuit board
Data Source
AI summary
A light-emitting device includes a light body having an internal electrode layer, and a conductive layer. The conductive layer has a first portion formed on the internal electrode layer and overlapping the light body in a first direction, and a second portion overlapping the light body in a second direction. The first direction is perpendicular to the second direction.