CSP Substrate Antenna Layout for Stable Wireless Packaging
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Solution Overview
Problem
Conventional semiconductor devices face limitations in antenna placement and interference issues due to electromagnetic noise, leading to unstable wireless communication and increased package size.
Innovation Solution
A semiconductor device with a chip size package and substrate, featuring an antenna on the substrate for wireless communication, conductive resin to reduce electromagnetic noise, and underfill to prevent deformation, allowing flexible antenna placement and reduced terminal connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If an antenna is placed inside the CSP package at part of a rewiring layer, then wireless communication is enabled, but the antenna size is limited and antenna installation area is restricted
Solution Approach 1:
The patent moves the antenna from the traditional planar rewiring layer (2D constraint) to the substrate surface (additional spatial dimension), allowing the antenna to be positioned outside the CSP package footprint. This dimensional transition enables larger antenna areas without increasing package size, resolving the contradiction between wireless communication capability and antenna installation area.
2Reliability
If the antenna is increased in size, then wireless communication performance is improved, but the antenna installation area becomes limited in CSP structure
Solution Approach 1:
By relocating the antenna to the substrate surface rather than confining it to the CSP's internal rewiring layers, the patent accesses additional spatial area that does not consume package volume. This allows larger antenna dimensions for improved wireless communication reliability without being constrained by the limited area within the CSP structure.
Solution Approach 2:
The patent separates the antenna function from the CSP package structure, placing the antenna on the substrate while the CSP contains only the semiconductor element and connection portions. This functional segmentation allows the antenna to be optimized independently for wireless performance without being constrained by package area limitations.
3Weight of stationary object
If terminals of the package are made small to reduce package size, then package miniaturization is achieved, but connection to external substrate becomes difficult
Solution Approach 1:
The patent relocates the antenna to the substrate surface, separating it from the CSP package structure. This allows the CSP to maintain miniaturized dimensions with small terminals for package size reduction, while the antenna on the substrate provides adequate area for wireless communication without compromising connection capability.
4Weight of stationary object
If wires inside the package are thinned or distance between wires is reduced to reduce package size, then package size is reduced, but electromagnetic waves interfere with each other causing noise
Solution Approach 1:
The patent extracts the antenna function from the internal rewiring structure of the CSP package and places it on the external substrate. This removal of the antenna from the dense wire environment eliminates electromagnetic interference between the antenna and package wires, allowing package miniaturization without compromising wireless communication quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables stable wireless communication, reduces electromagnetic noise, and maintains package size, while allowing high pixel count and frame rates without increasing wiring density or package size.
Implementation Method 1
an antenna connected to the connection portion for performing transmission and reception of a signal by wireless communication
Implementation Method 2
the substrate includes a conductive resin provided on a surface thereof that faces the chip size package. This brings about an action that an influence of electromagnetic noise when data transmission or reception is performed is reduced
Data Source
AI summary
Restrictions in placement of an antenna for performing transmission and reception of a signal by wireless communication when the antenna is used together with a CSP (Chip Size Package) are eliminated. A semiconductor device includes a chip size package and a substrate. The chip size package includes a semiconductor element. Further, the chip size package includes a connection portion that electrically connects the semiconductor element and an outside to each other. The substrate includes an antenna connected to the connection portion of the chip size package for performing transmission and reception of a signal by wireless communication. With this configuration, the semiconductor device performs transmission and reception of a signal to and from the outside through the antenna provided on the substrate.