CT Data Acquired System Airflow Guide for Temperature Uniformity
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Solution Overview
Problem
Existing CT apparatuses face challenges in achieving uniform temperature distribution across circuit boards, leading to inefficient heat dissipation and reduced service life of electrical components, which affects the quality of CT images.
Innovation Solution
A data acquired system (DAS) with a main structure featuring a cavity, a fan assembly, and an airflow guide that directs airflow from the fan to electrical components through a tapered channel, combined with a filter assembly and electromagnetic interference guard, ensuring efficient heat dissipation and electromagnetic compatibility, while being lightweight and stiff enough for mounting on a rotating gantry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional heat dissipation structure is used in DAS, then device complexity is reduced, but temperature uniformity across circuit boards deteriorates and heat dissipation efficiency is reduced
Solution Approach 1:
The heat dissipation structure is segmented into multiple independent airflow channels, each serving specific circuit boards. This segmentation allows targeted heat dissipation for different components while maintaining overall system simplicity through modular design.
Solution Approach 2:
Airflow guides are introduced as intermediary components to direct and control airflow paths. These guides mediate between the fan assembly and circuit boards, ensuring uniform heat dissipation distribution without requiring complex thermal management systems.
2Strength
If heavier materials are used to increase stiffness of DAS, then structural strength is improved, but weight increases making it difficult to mount on rotating gantry
Solution Approach 1:
The DAS housing employs composite material construction combining lightweight materials with reinforcing structures. This approach achieves necessary stiffness and strength while minimizing weight, enabling successful mounting on the rotating gantry of CT apparatus.
Solution Approach 2:
The DAS housing incorporates curved and optimized structural forms that provide high strength-to-weight ratio. The curved design distributes mechanical stresses more effectively than flat structures, enhancing stiffness without requiring additional heavy materials.
3Loss of energy
If airflow guide is positioned close to electrical components for effective heat dissipation, then heat dissipation efficiency is improved, but risk of electromagnetic interference increases
Solution Approach 1:
The airflow guide serves as a physical intermediary barrier between the airflow path and electrical components. It directs airflow for effective heat dissipation while simultaneously providing electromagnetic shielding, protecting sensitive components from interference during the heat dissipation process.
Solution Approach 2:
The airflow guide performs multiple functions simultaneously: it directs airflow for heat dissipation, provides electromagnetic shielding for component protection, and maintains proper spacing between airflow channels and electrical components. This multi-functionality resolves the contradiction between heat dissipation efficiency and electromagnetic interference risk.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves higher temperature uniformity across circuit boards, lowers the working temperature of electrical components, extends their service life, and maintains high CT image quality while being compatible with electromagnetic interference and dust prevention.
Implementation Method 1
a fan assembly disposed on the main structure, and an airflow guide disposed within the cavity to guide airflow from the fan assembly for heat dissipation of the electrical components
Implementation Method 2
the airflow guide is shaped to taper a cross section of an airflow channel in a direction from the fan assembly to the electrical components
Data Source
AI summary
A data acquired system is provided. The data acquired system includes a main structure with a cavity formed therein, the cavity having a bottom for mounting a circuit board with electrical components thereto, a fan assembly disposed on the main structure, and an airflow guide disposed within the cavity and configured to guide airflow from the fan assembly for heat dissipation of the electrical components, the airflow guide positioned at a distance above the electrical components to form a gap between the airflow guide and the electrical components, wherein a sidewall of the cavity is provided with an air vent corresponding to the gap such that the airflow passes through the gap and is discharged from the air vent.