CT Detector Module Interconnects for Signal Integrity
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Solution Overview
Problem
Current interconnect structures between sensor elements and data acquisition systems in CT imaging systems suffer from non-optimal signal integrity due to long metal traces, increased capacitance, and decreased reliability as the density of sensor elements increases, making it difficult to route interconnects effectively.
Innovation Solution
The implementation of a short, low capacitance interconnect system using a combination of wire bonds and bump bonds to connect sensor elements directly to integrated circuits and electronic substrates, allowing for tileable units with minimal gaps and improved signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If long metal traces on flexible or rigid circuit board are used for interconnections, then routing flexibility is improved, but capacitance increases and signal integrity deteriorates
Solution Approach 1:
The patent extracts the interconnection function from traditional long metal traces and replaces it with direct bump bonds connecting sensor elements to substrate pads. This eliminates the intermediate routing layer and reduces capacitance while maintaining flexibility through the modular tile design.
Solution Approach 2:
The patent transitions from planar routing on circuit board surfaces to three-dimensional stacking with sensor elements directly mounted on substrate pads. This vertical arrangement reduces interconnection length and capacitance while maintaining routing flexibility through modular assembly.
2Measurement precision
If sensor element density increases, then detector resolution is improved, but interconnect routing becomes more difficult and capacitance increases
Solution Approach 1:
The patent segments the detector into modular tiles with sensor elements directly connected to substrate pads. This segmentation allows high-density sensor arrays while simplifying interconnect routing to local connections rather than complex global routing.
Solution Approach 2:
The patent introduces substrate pads as intermediary connection points between sensor elements and external circuitry. This intermediary structure simplifies routing by providing direct connection points, eliminating the need for complex trace routing through the substrate.
3Adaptability or versatility
If more layers of packaging are used to route interconnects, then routing capability is improved, but capacitance increases and reliability decreases
Solution Approach 1:
The patent extracts the routing function from multiple packaging layers and implements it through direct bump bonds from sensor elements to substrate pads. This eliminates the need for complex multi-layer routing while maintaining routing capability.
Solution Approach 2:
Instead of routing signals through multiple layers of packaging, the patent inverts the approach by connecting sensor elements directly to substrate pads in a single layer, reducing capacitance and improving reliability while maintaining routing capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances signal integrity by reducing unwanted signal current, capacitance, and inductance, while enabling more reliable and efficient transmission of analog and digital signals, facilitating the construction of large area detectors with improved manufacturing and serviceability.
Implementation Method 1
a sensor element in the direct conversion detector converts this x-ray to energy to produce an analog electrical signal corresponding to an incident photon flux
Implementation Method 2
A plurality of wire bonds and bump bonds form short low capacitance interconnects between the sensor element and various components in a DAS
Data Source
AI summary
A detector module for a CT imaging system is provided. The detector module includes a sensor element to convert x-rays to electrical signals. The sensor element is coupled to a data acquisition system (DAS) via an interconnect system, the DAS comprised of an electronic substrate and an integrated circuit. The interconnect system couples the sensor element, electronic substrate, and integrated circuit by way of a contact pad interconnect together with a wire bond interconnect or an additional contact pad interconnect.