CT Detector Cooling Apparatus with Overlapping Tunnel Cavities
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Solution Overview
Problem
Modern CT devices face challenges in thermal management due to the close proximity of heat sources to X-ray sensor elements, leading to unstable operating temperatures and temperature gradients within CT detector modules.
Innovation Solution
A cooling apparatus comprising a series of cooling elements with metallic materials of high thermal conductivity, featuring continuous tunnel-shaped cavities for fluid flow, designed to make surface-to-surface contact with the X-ray converter element, and arranged to ensure overlapping cavities for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal adhesive or thermal paste is used to create a thermal interface between the X-ray converter element and the metal frame, then thermal contact is established, but the heat transport is not well-defined due to uncontrolled interface quality
Solution Approach 1:
The patent removes the thermal adhesive/paste layer from the thermal interface and replaces it with a direct mechanical and thermal connection between the converter element and the cooling structure. This extraction eliminates the uncontrolled thermal resistance layer while maintaining thermal contact through precisely engineered contact surfaces and clamping mechanisms.
Solution Approach 2:
The cooling structure is pre-assembled with the detector module housing before the converter element is installed. This preliminary assembly ensures that the thermal interface geometry is predetermined and controlled, allowing for consistent and reproducible heat transport characteristics without relying on variable adhesive layers.
2Temperature
If cooling air is introduced at the front of the detector module, then cooling is provided to sensors near the aperture, but sensors in the rear area receive less cooling air and are heated by remaining sensor boards
Solution Approach 1:
The cooling structure is divided into multiple independent cooling channels that are distributed throughout the detector module housing. Each channel delivers cooling air directly to specific regions (front, middle, rear), ensuring uniform cooling distribution across all sensor boards regardless of their position in the stack.
Solution Approach 2:
The cooling system transitions from a single-direction (front-to-back) cooling approach to a multi-dimensional cooling architecture where cooling air is delivered through laterally distributed channels. This allows simultaneous cooling of front and rear sensors by introducing cooling air at multiple locations and directing it through three-dimensional cooling pathways.
3Device complexity
If ASICs are integrated closer to the X-ray sensor layer to reduce analog path length, then integration is improved, but heat sources are brought closer to the sensors increasing thermal challenges
Solution Approach 1:
The cooling structure is merged with the detector module housing to form an integrated thermal management system. The housing itself becomes part of the heat dissipation pathway, with cooling channels and heat dissipation surfaces directly coupled to the converter element mounting structure, enabling efficient heat removal from the integrated ASIC-sensor assembly.
Solution Approach 2:
The metal housing and cooling structure serve as an intermediary thermal pathway between the heat-generating ASICs and the external environment. This intermediary structure provides a controlled thermal conduction path that efficiently transports heat away from the sensitive sensor elements while allowing the ASICs to remain integrated close to the sensors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed cooling apparatus facilitates efficient heat dissipation for CT detector modules, maintaining stable operating temperatures and reducing temperature gradients, thereby enhancing the performance and reliability of CT devices.
Implementation Method 1
The cooling elements each have a metallic material that has a plurality of continuous tunnel-shaped cavities along the first direction, which are designed for the through-flow by a fluid along the first direction. The cooling elements are designed to make surface-to-surface contact with a corresponding thermal contact surface of the X-ray converter element.
Implementation Method 2
The cooling elements are designed for the through-flow by a fluid along the first direction. In the case of integrating X-ray converters, the analog X-ray sensor layer is formed by a suitable sensor layer, for instance a scintillator, in combination with a photodiode, whereas counting X-ray converters use a direct conversion semiconductor sensor.
Data Source
AI summary
A cooling apparatus comprises a plurality of cooling elements arranged in a row along a first direction. Each cooling element has a metallic material that has a plurality of continuous tunnel-shaped cavities along the first direction. The cavities are configured for through-flow by a fluid along the first direction. The cooling elements are configured to make surface-to-surface contact with a corresponding thermal contact surface of the X-ray converter element, and the cooling elements are arranged with respect to each other in the row such that the respective cavities overlap at least partially at interfaces between adjacent cooling elements.