Single-Layer Ceramic Substrate for CT Detector Interconnects
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Solution Overview
Problem
Conventional multi-layered ceramic substrates used in CT detectors are costly and unreliable due to open connections in multiple conductive layers, increasing the cost and downtime of CT scanners.
Innovation Solution
The use of single-layered thick or thin-film ceramic substrates and direct bonding of photodiode circuits to flexible circuit substrates provides cost-effective and reliable interconnectivity between photodetectors and data acquisition electronics, eliminating the need for multi-layered substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multi-layered ceramic substrates are used for interconnectivity, then electrical coupling between photodetectors and electronics is achieved, but the cost increases and reliability decreases due to open connections in multiple conductive layers
Solution Approach 1:
The patent extracts and eliminates the problematic multi-layered ceramic substrate structure, replacing it with a simplified single-layer substrate that directly bonds photodetectors to flexible circuit boards. This removal of complex intermediate layers resolves the reliability issues caused by open connections while reducing overall device complexity.
Solution Approach 2:
Instead of using multiple conductive layers stacked vertically to achieve interconnectivity, the patent inverts the approach by using a single-layer substrate with direct lateral connections to flexible circuit boards. This inversion simplifies the interconnection architecture and eliminates the reliability problems associated with multiple layers.
2Ease of manufacture
If multi-layered ceramic substrates are used for interconnectivity, then electrical coupling is provided, but manufacturing cost increases
Solution Approach 1:
The patent replaces expensive multi-layered ceramic substrates with cheaper alternative materials such as single-layer ceramic or organic substrates that can be directly bonded to flexible circuit boards. This substitution significantly reduces manufacturing cost while maintaining or improving reliability through simplified construction.
3Device complexity
If single-layered substrate is used instead of multi-layered substrate, then cost is reduced and reliability is improved, but node pitch change capability must be achieved differently
Solution Approach 1:
The patent introduces flexible circuit boards as intermediary elements that bridge the photodetector array and the readout electronics. These flexible circuits serve as the mediating structure that handles node pitch changes and routing, allowing the single-layer substrate to maintain manufacturing precision without requiring complex multi-layer construction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the cost and improves the reliability of CT detectors by providing efficient interconnectivity without the risks of open connections, thereby minimizing downtime in medical or security CT scanners.
Implementation Method 1
each of the photodetectors of the photodetector circuit includes a respective active region disposed on or near the first facing to detect optical energy
Implementation Method 2
The second facing (opposite the first facing) of the photodetector circuit is directly bonded to the contact nodes disposed on the facing of the flexible circuit substrate
Implementation Method 3
The interconnect substrate includes conductive paths extending from the first facing to the second facing to provide interconnectivity between the array of photodetectors on the photodetector circuit and the array of contact nodes
Data Source
AI summary
The present disclosure includes multiple ways of providing photodetector interconnectivity using, for example: a) single-layered thick or thin film ceramic substrate to change a node pitch from one facing to another, and/or b) direct bonding of photodiode circuit to a flex cable interconnect.