CT Detector Module Carrier Heat Dissipation Design
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Solution Overview
Problem
Modern CT detector modules face challenges in heat management due to the proximity of heat sources to sensitive X-ray sensor elements, leading to unstable operating temperatures and temperature gradients.
Innovation Solution
A module carrier with a one-piece, tunnel-shaped hollow body is designed to provide efficient heat dissipation by allowing fluid flow and incorporating a heat transfer section for direct or indirect contact between cooling elements and X-ray converter elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat-conducting adhesive or paste is used to create thermal interface between X-ray converter element and metal frame, then heat transfer is enabled, but the amount of heat transported cannot be defined due to variable interface quality
Solution Approach 1:
The patent removes the heat-conducting adhesive or paste from the thermal interface and replaces it with a direct mechanical contact structure. The module carrier's cooling structure is designed to directly contact the X-ray converter element, eliminating the intermediate thermal interface material that caused variability in heat transfer.
Solution Approach 2:
The module carrier serves as a new intermediary structure between the X-ray converter element and the cooling system. It provides a defined thermal pathway through its engineered contact surfaces and internal fluid channels, replacing the undefined thermal path through adhesive/paste with controlled conduction and convection.
2Device complexity
If ASICs are integrated into compact stack structure with X-ray sensor layer, then integration is improved, but heat source proximity to sensor elements increases
Solution Approach 1:
The patent extracts the thermal management function from the integrated stack structure by introducing a separate module carrier with dedicated cooling structures. This allows the ASICs and sensor layers to remain integrated for functionality while providing independent thermal control to mitigate heat proximity issues.
3Temperature
If cooling air inlet openings are positioned to maximize cooling efficiency, then front sensors receive adequate cooling, but rear sensors receive insufficient cooling due to air displacement
Solution Approach 1:
The patent segments the cooling approach by providing multiple cooling structures positioned at different locations within the module carrier. Instead of relying on a single cooling air inlet, the design incorporates distributed thermal management elements that independently cool different regions of the detector array.
Solution Approach 2:
The module carrier acts as an intermediary thermal management system between the heat-generating sensor elements and the cooling medium. It incorporates engineered fluid channels and heat dissipation structures that actively manage heat removal, replacing passive convection through air inlet openings.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables improved heat dissipation and temperature stabilization within CT detector modules, reducing temperature gradients and maintaining semiconductor sensor performance.
Implementation Method 1
a heat transfer section which is designed to provide a heat-conducting contact between the at least one cooling element and the X-ray converter element
Implementation Method 2
the hollow body is designed to enable a fluid to flow through along its longitudinal direction of extent
Data Source
AI summary
One or more example embodiments relates to a module carrier for a CT detector module. The module carrier includes a one-piece tunnel-shaped hollow body, the hollow body including an elongated hollow space and at least two openings, two openings of the at least two openings are opposite one another along a longitudinal direction of the hollow body, the hollow body configured to, be arranged on an X-ray converter element on an outer side of the hollow body, receive at least one cooling element in the hollow space via at least one of the at least two openings, and enable a fluid to flow through the hollow body along the longitudinal direction of the hollow body, wherein the hollow body has a heat transfer section configured to provide a heat-conducting contact between the at least one cooling element and the X-ray converter element.