CT Detector Module Heat Dissipation Structure
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Solution Overview
Problem
Computed tomography (CT) detector modules generate significant heat due to the analog-to-digital converter (ADC) in the data acquisition circuitry, which can interfere with the performance of photodetectors and scintillators, necessitating an effective heat dissipation structure.
Innovation Solution
The detector module incorporates a plurality of detector sub-modules with a frame that supports a detection layer and data acquisition circuitry, featuring thermally connected fins for heat dissipation, and a mating connection system using positioning elements and recessed pockets for assembly, allowing for efficient heat transfer and module alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If data acquisition circuitry is added to process radiation signals, then measurement capability is improved, but heat generation increases and interferes with detector performance
Solution Approach 1:
The patent extracts the harmful heat generation function from the data acquisition circuitry by separating it physically from the sensitive detector components. The circuitry is positioned in a dedicated housing away from the photodetector and scintillator, removing the source of thermal interference from proximity to the measurement components.
Solution Approach 2:
The patent introduces intermediary thermal management components including heat sinks, thermal conductive materials, and insulation structures between the heat-generating circuitry and the temperature-sensitive detectors. These intermediaries facilitate controlled heat transfer away from sensitive areas while maintaining electrical connectivity.
2Area of stationary object
If multiple detector sub-modules are assembled to increase detection area, then detection coverage is improved, but assembly complexity increases
Solution Approach 1:
The patent divides the detector system into multiple standardized sub-modules, each containing a photodetector array, scintillator, and associated circuitry. These modular units can be independently manufactured and then assembled in various configurations to achieve the desired total detection area, simplifying both manufacturing and assembly processes.
Solution Approach 2:
The patent designs universal mounting interfaces and standardized connection protocols for detector sub-modules that allow the same module design to be used in different positions and configurations. This universality reduces the number of unique components needed and simplifies assembly procedures across the entire detector array.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat dissipation structure effectively reduces thermal interference, enhancing the performance and reliability of the detector module by managing heat generated by the data acquisition circuitry, thereby improving image quality and module stability.
Implementation Method 1
a heat dissipation structure to reduce the heat produced by the detector module
Implementation Method 2
The detector module may include a heat dissipation structure that may be configured to dissipate heat produced by the detector module
Data Source
AI summary
A detector module is provided. The detector module may include a plurality of detector sub-modules. Each of the plurality of detector sub-modules may include a detection layer, at least one data acquisition circuitry, a frame for supporting the detection layer, and a positioning element for assembling the plurality of detector sub-modules. The frame may include a plurality of heat transfer fins that are thermally connected with the at least one data acquisition circuitry for dissipating heat produced by the at least one data acquisition circuitry.