CT Detector Sensor Positioning Substrate Precision
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Solution Overview
Problem
The manufacturing process of CT detector modules requires high precision in positioning sensor units, as small deviations in spacing and height can significantly affect imaging quality, and existing methods are prone to inaccuracies during the soldering process.
Innovation Solution
A positioning substrate with a flat, precise surface is used to temporarily connect sensor units at a fixed position using a connecting layer, allowing for precise alignment and attachment to a module carrier, independent of other intermediate layers' positioning accuracies, and enabling precise conductive connections between electronics boards and readout units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If reflow soldering method is used to connect sensor units to readout units and substrate, then electrical connections are established, but positioning precision deteriorates due to deviations in subpixel range during soldering process
Solution Approach 1:
The patent applies preliminary action by positioning sensor units on a positioning substrate with precisely defined positioning elements (such as positioning holes or mechanical features) before the soldering process. The positioning substrate provides a stable reference framework that pre-establishes the correct spatial relationships among sensor units, readout units, and substrate, thereby compensating for potential positioning errors that would otherwise occur during soldering.
Solution Approach 2:
The positioning substrate serves as an intermediary component between the sensor units and the final substrate assembly. It provides a stable platform with precise positioning features that mediates the connection process, allowing sensor units to be accurately positioned relative to each other and to the readout units before being permanently mounted to the substrate.
2Ease of manufacture
If small deviations in spacing and height of sensor units are present, then manufacturing is easier, but imaging quality deteriorates significantly
Solution Approach 1:
The patent replaces reliance on mechanical soldering precision with a positioning substrate that provides mechanical positioning features (such as positioning holes, recesses, or geometric features). This positioning substrate acts as a mechanical reference system that ensures accurate spacing and height of sensor units, thereby maintaining imaging quality while simplifying the manufacturing process.
3Ease of manufacture
If multiple reflow soldering processes are used to connect hybrids to substrate, then electrical connections are established, but positioning accuracy deteriorates due to accumulation of errors from multiple steps
Solution Approach 1:
The patent merges the positioning function into a single positioning substrate that simultaneously provides positioning references for sensor units, readout units, and the substrate itself. This unified positioning system allows all components to be positioned in one coordinated process rather than through multiple separate soldering steps, thereby preventing error accumulation and improving self-orientation accuracy.
Data Source
AI summary
A method for positioning sensor units in a detector module for a CT device includes arranging a connecting layer on a positioning substrate. Sensor units and readout units, forming sensor readout arrangements, are positioned relative to the positioning substrate. The sensor units are temporarily connected to the positioning substrate at a fixed position by the connecting layer. Electronics boards are positioned, and conductive connections are produced between the electronics boards and contacts of the readout units, such that sensor boards are obtained. The sensor units are then positioned by the positioning substrate relative to a module carrier and are attached to the module carrier, such that a detector module is obtained.