Multilayer Capacitor External Electrode for Bending and Moisture Resistance

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Solution Overview

Problem

Multilayer ceramic capacitors face challenges in achieving improved bending strength and moisture resistance reliability, particularly due to the penetration of external moisture through epoxy used to enhance bending strength.

Innovation Solution

A multilayer electronic component design that includes a body with a dielectric layer and internal electrodes alternately stacked, and an external electrode structure comprising a connection electrode layer with copper and glass, a band electrode layer with silver and glass, and a conductive resin layer between the band electrode layer and the plating layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If epoxy is added to external electrode to improve bending strength, then bending strength characteristics are improved, but moisture resistance reliability deteriorates due to easy penetration of external moisture

Engineering Contradiction:
Improvebending strengthVSAvoidmoisture resistance reliability
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The external electrode is divided into multiple functional layers: a base layer (silver paste with glass), a bending strength improvement layer (epoxy-based conductive paste), and a plating layer. This segmentation allows each layer to perform its specific function - the base layer provides moisture barrier, the intermediate layer provides bending strength, and the plating layer provides solderability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces an intermediate layer made of epoxy-based conductive paste between the silver paste layer and the plating layer. This intermediary layer acts as a mediator that provides bending strength improvement while the underlying silver paste layer with glass content maintains moisture resistance. The intermediary layer resolves the contradiction by decoupling the moisture barrier function from the bending strength function.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Volume of moving object

If miniaturization is pursued to meet high-output electronic devices, then device size is reduced, but manufacturing precision requirements increase

Engineering Contradiction:
Improvecomponent sizeVSAvoidelectrode layer precision
Core Design Contradiction:
Volume of moving objectVSManufacturing precision

Solution Approach 1:

The patent changes the material parameters of the electrode layers, specifically incorporating glass content in the silver paste layer (5-20 wt%) and controlling the thickness and material composition of the epoxy-based conductive paste layer. These parameter changes allow the external electrode to maintain adequate bending strength and functionality even as the overall component size is reduced for miniaturization applications.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20250132093A1Multilayer electronic component
Publication Date: 2025.04.24 SAMSUNG ELECTRO MECHANICS CO LTD
  • US20250132093A1 patent drawing
  • US20250132093A1 patent drawing
  • US20250132093A1 patent drawing

AI summary

A multilayer electronic component according to an embodiment of the present disclosure includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, and a plating layer disposed on the electrode layer, wherein the electrode layer includes a connection electrode layer including copper (Cu) and glass, and a band electrode layer including silver (Ag) and glass, and the external electrode further includes a conductive resin layer disposed between the band electrode layer and the plating layer and including a conductive metal and a resin.