Cu Alloy Powder Composition for Dense Low-Void Additive Manufacturing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional Cu-based alloys are unsuitable for processes involving rapid melting and rapid solidification, such as additive manufacturing, thermal spraying, and laser coating, as they result in low-density shaped objects with voids and poor electroconductivity.
Innovation Solution
A Cu-based alloy powder with specific compositions and structures, including elements like Cr, Fe, Ni, Zr, and Nb, optimized for rapid melting and solidification processes, which suppresses laser reflectance and heat loss, ensuring high-density and high-electroconductivity shaped objects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional Cu-based alloys are used for rapid melting and rapid solidification processes, then the material can be processed, but the resulting shaped objects have low density and contain voids
Solution Approach 1:
The patent applies parameter changes by precisely controlling the chemical composition parameters of the Cu-based alloy (adding specific amounts of Cr, Fe, Ni, Zr, and Nb elements within defined ranges) and physical parameters (particle size distribution D50/TD ratio and sphericity). These parameter optimizations enable the alloy to achieve high density and eliminate voids during rapid melting and solidification processes.
2Reliability
If conventional Cu-based alloys are used for rapid melting and rapid solidification, then processing can proceed, but electroconductivity deteriorates
Solution Approach 1:
The patent optimizes composition parameters by limiting the content of electroconductivity-deteriorating elements (Si ≤ 0.20%, P ≤ 0.10%, S ≤ 0.10%) while incorporating beneficial alloying elements (Cr, Fe, Ni, Zr, Nb) within specific ranges. This parameter control achieves superior electroconductivity while maintaining high manufacturing quality in the shaped objects.
3Manufacturing precision
If Cu-based alloy powder is used for additive manufacturing, then three-dimensional shaped objects can be produced, but high density is difficult to achieve
Solution Approach 1:
The patent changes the powder material parameters (composition, particle size distribution with D50/TD ratio of 0.2-20×10^-5 m^4/Mg, and sphericity of 0.80-0.95) to enable high-density shaped objects to be obtained through standard additive manufacturing processes without requiring difficult or complex manufacturing adjustments.
4Use of energy by moving object
If conventional Cu-based alloys undergo rapid melting and rapid solidification, then shaped objects are produced, but laser reflectance causes heat loss
Solution Approach 1:
The patent modifies the optical parameters of the Cu-based alloy by incorporating alloying elements (Cr, Fe, Ni, Zr, Nb) that alter the material's laser reflectance characteristics. This parameter change improves heat absorption efficiency and reduces energy loss during laser-based rapid melting and solidification processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The optimized Cu-based alloy powder achieves high-density and low-void shaped objects with superior electroconductivity, suitable for complex three-dimensional additive manufacturing and other rapid solidification processes.
Implementation Method 1
suppresses laser reflectance and heat loss
Implementation Method 2
a metal material is melted rapidly and quenched to solidify
Implementation Method 3
Cu-based alloys are suitable for such applications [high conductivity required]
Data Source
AI summary
Provided is a Cu-based alloy powder that is suitable for a process involving rapid melting and rapid solidification and that can provide a shaped object superior in characteristics. The powder is composed of a Cu-based alloy, which contains an element M being one or more elements selected from Cr, Fe, Ni, Zr, and Nb: 0.1% by mass or more and 10.0% by mass or less, Si: more than 0% by mass and 0.20% by mass or less, P: more than 0% by mass and 0.10% by mass or less, and S: more than 0% by mass and 0.10% by mass or less, the balance being Cu and inevitable impurities. This powder has a ratio (D50/TD) of the average particle diameter D50 (μm) thereof to the tap density TD (Mg/m3) is 0.2×10−5·m4/Mg or more and 20×10−5·m4/Mg or less, and has a sphericity of 0.80 or more and 0.95 or less.