Cu Alloy Powder Composition for Dense 3D Printing With Conductivity
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Solution Overview
Problem
Existing Cu alloy powders for additive manufacturing face challenges in achieving high relative density, hardness, and electrical conductivity due to the adverse effects of excessive Ni addition, which decreases electrical conductivity and complicates achieving a balanced combination of properties like shapability, hardness, and electrical conductivity.
Innovation Solution
A Cu alloy powder composition with specified amounts of Ni, Si, and optional additives like Mg, Zr, Cr, Nb, Mn, Fe, Zn, Sn, C, P, S, and Ag, with a controlled Ni/Si ratio, is used to facilitate precipitation strengthening and maintain high electrical conductivity, hardness, and shapability through intermetallic compound formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If Ni is added to reduce laser reflectivity and improve shapability, then relative density improves, but electrical conductivity deteriorates
Solution Approach 1:
The patent optimizes the Ni content parameter within a specific range (1.20-7.30%) and controls the Ni/Si ratio (3.00-6.00) to achieve the best balance between laser absorption and electrical conductivity preservation
Solution Approach 2:
The patent creates a multi-element composite alloy system (Cu-Ni-Si-Mg-Zr-Cr-Nb-Mn-Fe-Zn-Sn-C-P-S-Ag) where different elements work synergistically: Ni and Si improve shapability while Ag and controlled Ni content maintain electrical conductivity, resolving the contradiction between relative density and electrical conductivity
2Strength
If Ni is added to increase hardness through solid solution strengthening, then hardness improves, but electrical conductivity decreases due to excessive Ni addition
Solution Approach 1:
The patent employs a composite strengthening mechanism combining precipitation hardening (Ni-Si intermetallic compounds) with solid solution strengthening (Mg, Zr, Cr, Nb, Mn, Fe, Zn, Sn in Cu matrix), allowing hardness improvement without excessive Ni addition that would harm electrical conductivity
Solution Approach 2:
The patent changes the strengthening mechanism from relying solely on solid solution strengthening to precipitation hardening by controlling Ni/Si ratio and total Ni+Si content (1.50-9.00%), achieving hardness improvement while preserving electrical conductivity
3Strength
If Ni and Si are added to achieve high hardness and shapability, then relative density and hardness improve, but achieving high electrical conductivity becomes difficult
Solution Approach 1:
The patent introduces Ag as an additional element that forms a multi-element composite system, where Ag contributes to electrical conductivity while Ni and Si provide hardness and shapability, achieving a balanced combination of all three properties
Solution Approach 2:
The patent precisely controls multiple parameters: Ni content (1.20-7.30%), Si content (0.25-1.80%), Ni/Si ratio (3.00-6.00), and total Ni+Si content (1.50-9.00%), along with other alloying elements, to achieve the optimal balance between relative density, hardness, and electrical conductivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the production of additive-manufactured articles with high relative density, balanced hardness, and electrical conductivity, surpassing conventional methods by achieving a superior combination of properties.
Implementation Method 1
a predetermined amount of Si is added as a third component in addition to Ni, and the mass ratio of Ni/Si is specified in a predetermined range to achieve high hardness, excellent shapability, and high electrical conductivity
Data Source
Figure 1
AI summary
Provided are a Cu alloy powder for additive manufacturing, which can be shaped at high relative density, and from which an additive-manufactured article having high hardness, high electrical conductivity, and high thermal conductivity can be manufactured; and a shaped article using the Cu alloy powder for additive manufacturing. The Cu alloy powder for additive manufacturing contains, in % by mass, 1.20 to 7.30% of Ni, 0.25 to 1.80% of Si, 0.40% or less of Mg, 0.00 to 2.00% of a total amount of one or more elements selected from Zr, Cr, Nb, Mn, Fe, Zn and Sn, 0.000 to 0.020% of C, 0.000 to 0.020% of P, 0.000 to 0.020% of S, and the balance consisting of Cu and unavoidable impurities, wherein the Ni/Si ratio of the Ni content to the Si content is 3.00 to 6.00, and the total content of Ni and Si is 1.50 to 9.00%.