Cu-CuO Composite Filler for Thermal Compound Insulation
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Solution Overview
Problem
Conventional thermal compounds with high thermal conductivity often exhibit increased electrical conductivity, limiting their use in devices requiring electrical insulation properties, as the components used to enhance thermal conductivity can lead to short-circuits.
Innovation Solution
A thermal compound composition utilizing a Cu—CuO composite filler with a Cu core and CuO whisker crystal structure outer shell, combined with additional fillers like AlN, Al2O3, or BN, to achieve high thermal conductivity while maintaining electrical insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional thermal conductive fillers (alumina, boron nitride, aluminum nitride, zinc oxide, magnesium oxide) are used to increase thermal conductivity, then thermal dissipation performance is improved, but electrical conductivity is also increased leading to short-circuit risks
Solution Approach 1:
The patent uses a composite filler system combining Cu (high thermal conductivity) with insulating materials (alumina, boron nitride, aluminum nitride, zinc oxide, or magnesium oxide). This composite structure allows the Cu particles to provide thermal conduction pathways while the insulating matrix material prevents electrical conductivity, thereby resolving the contradiction between thermal conductivity enhancement and electrical insulation maintenance.
2Temperature
If Cu filler is used to maximize thermal conductivity, then heat dissipation is improved, but electrical conductivity increases causing short-circuits
Solution Approach 1:
The insulating matrix material (alumina, boron nitride, aluminum nitride, zinc oxide, or magnesium oxide) acts as an intermediary between Cu particles, allowing thermal energy to be conducted through Cu while preventing electrical charge transfer. This intermediary material enables the system to achieve high thermal conductivity without the harmful effect of electrical short-circuits.
Solution Approach 2:
The patent creates local quality differentiation within the thermal compound by distributing Cu particles (providing thermal conduction) within an insulating matrix (preventing electrical conduction). Each Cu particle maintains its high thermal conductivity locally, while the surrounding insulating material ensures electrical isolation, thereby achieving overall thermal conductivity enhancement without electrical short-circuit risks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The Cu—CuO composite filler enhances thermal conductivity and improves electrical insulation properties, outperforming traditional thermal compounds using Cu by increasing contact with additional fillers and preventing electrical short-circuits, as demonstrated through comparative experiments.
Implementation Method 1
The Cu—CuO composite filler enhances thermal conductivity and improves electrical insulation properties, outperforming traditional thermal compounds using Cu by increasing contact with additional fillers
Implementation Method 2
The Cu—CuO composite filler enhances thermal conductivity and improves electrical insulation properties, outperforming traditional thermal compounds using Cu by increasing contact with additional fillers and preventing electrical short-circuits
Data Source
AI summary
Provided is a thermal compound composition having heat dissipation and electrical insulation properties, where the thermal compound composition includes a Cu—CuO composite filler having a Cu core and a shell composed of CuO having a whisker crystal structure. The CuO having the whisker crystal structure is prepared by reacting Cu particles in a basic solution so that an outer shell thereof is grown into whisker-shaped CuO.