Cu-Glass External Electrode Structure for Plating Adhesion
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Solution Overview
Problem
In multilayer electronic components with a Cu and glass base electrode layer, there are issues with insufficient plating layer formation on glass surfaces and reduced adhesive force between electrode layers, affecting moisture resistance, ESR characteristics, and thermal stability.
Innovation Solution
Incorporating an oxide layer containing Cu adjacent to the plating or conductive resin layer on the Cu and glass electrode layer to enhance interlayer adhesion and plating properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a plating layer is formed on the electrode layer including Cu and glass, then electrical conductivity and airtightness are improved, but the plating layer is not sufficiently formed on the glass surface
Solution Approach 1:
The patent introduces an intermediate layer between the glass surface and the plating layer. This intermediate layer acts as a mediator that enables the plating layer to be properly formed on the glass surface, which would otherwise be difficult due to glass's non-conductive properties. The intermediate layer provides a suitable surface for plating deposition while maintaining the underlying glass structure.
2Strength
If a conductive resin layer is formed on the electrode layer including Cu and glass, then mechanical strength is improved, but adhesive force between layers is reduced
Solution Approach 1:
The patent introduces an intermediate layer between the electrode layer (Cu and glass) and the conductive resin layer. This intermediate layer serves as a mediator that enhances adhesion between the two layers while allowing the conductive resin layer to provide mechanical strength. The intermediate layer creates proper bonding interfaces for both the metallic electrode and the resinous coating.
3Productivity
If the space between mounted electronic components is minimized to achieve high integration, then productivity is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent introduces a convex portion on the surface of the external electrode, creating a curved or elevated structure. This convex shape provides a distinct, raised positioning feature that facilitates precise alignment and placement during mounting processes. The curved surface geometry helps in achieving accurate positioning even when spacing between components is minimized, thereby supporting high integration while maintaining placement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves the interlayer adhesive force, plating properties, and overall reliability of the multilayer electronic component by ensuring complete plating coverage and increased contact area between layers, thereby enhancing moisture resistance, thermal stability, and electrical conductivity.
Implementation Method 1
an oxide including Cu is disposed on at least a portion of Cu and at least a portion of glass disposed adjacent to the plating layer
Data Source
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AI summary
A multilayer electronic component according to an example embodiment of the present disclosure includes: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body, wherein the external electrode includes an electrode layer disposed on the body and connected to an internal electrode and including Cu and glass, and an upper electrode layer disposed on the electrode layer, at least a portion of the Cu and at least a portion of the glass are disposed adjacent to the upper electrode layer, and an oxide including Cu is disposed on at least a portion of Cu and at least a portion of the glass disposed adjacent to the upper electrode layer.