Cu-Ni-Al Copper Alloy Plate Composition for Low-Smut Etching
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Solution Overview
Problem
Cu—Ni—Al-based copper alloys face challenges in suppressing smut generation during etching, which deteriorates etching properties and increases productivity risks due to edge cuts and ruptures during the manufacturing of high-strength, thin-walled electroconductive spring members.
Innovation Solution
Increasing the Cu concentration in Ni—Al-based precipitates within a specific chemical composition range and employing a controlled manufacturing process involving cast slab heating, hot rolling, solution treatment, aging treatment, and final heat treatment to achieve a Cu concentration of 15 to 50 mass % in precipitates, resulting in a Vickers hardness of 300 HV or more and reduced smut generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a large amount of precipitates is formed to increase strength, then the strength is improved, but smut generation during etching increases
Solution Approach 1:
The invention changes the chemical composition parameters of the precipitates by controlling the Cu concentration to be 15-50 mass% and Ni/Al ratio to satisfy Ni/Al≤9.0. This parameter optimization allows the precipitates to provide sufficient strength while being soluble in etching solutions, thereby reducing smut generation during etching processes.
2Length of stationary object
If the number of passes or rolling load is increased in final cold rolling to obtain thin-walled parts, then the material thickness is reduced, but productivity decreases and risk of edge cut or rupture increases
Solution Approach 1:
The invention optimizes the chemical composition parameters (Cu concentration: 15-50 mass%, Ni/Al ratio: Ni/Al≤9.0) to create a material with improved ductility and reduced rolling resistance. This allows thin-walled parts to be manufactured with fewer rolling passes and lower rolling loads, thereby maintaining high productivity while avoiding edge cuts and ruptures.
3Length of stationary object
If the number of passes or rolling load is increased in final cold rolling to obtain thin-walled parts, then the material thickness is reduced, but the risk of edge cut or rupture increases
Solution Approach 1:
By optimizing the chemical composition (Cu: 15-50 mass%, Ni/Al ratio: Ni/Al≤9.0), the invention creates a material with enhanced formability and reduced rolling resistance. This enables the production of thin-walled parts with fewer rolling passes and lower loads, significantly reducing the risk of edge cuts and ruptures while maintaining high dimensional accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The process effectively suppresses smut generation and enhances the strength of Cu—Ni—Al-based copper alloys, allowing for reduced rolling loads in the final cold rolling step and improved dimensional accuracy of electroconductive spring members.
Implementation Method 1
a first aging treatment in a higher temperature range and a second aging treatment in a conventional and common temperature range are successively performed
Implementation Method 2
a technique for obtaining a material having high strength, excellent workability, and high electrical conductivity by precipitating a γ′ phase containing Si with an average particle diameter of 100 nm or less in a step of performing a solution treatment at 700 to 1020° C.
Data Source
AI summary
A copper alloy plate material, having a chemical composition comprising, in mass %, Ni: 10.0 to 30.0%, Al: 1.00 to 6.50%, Ag: 0 to 0.50%, B: 0 to 0.1%, Co: 0 to 2.0%, Cr: 0 to 0.5%, Fe: 0 to 2.0%, Ga: 0 to 0.5%, Ge: 0 to 0.5%, In: 0 to 0.5%, Mg: 0 to 2.0%, Mn: 0 to 2.0%, P: 0 to 0.2%, Si: 0 to 2.0%, Sn: 0 to 2.0%, Ti: 0 to 2.0%, Zn: 0 to 2.0%, and Zr: 0 to 0.3%, with the balance of Cu and unavoidable impurities, and satisfying Ni/Al≤9.0, wherein a Cu concentration XCu, in a precipitate represented by XCu (mass %)=[Cu/(Cu+Ni+Al)]×100 is 15 to 50 mass %, and a Vickers hardness is 300 HV or more.