Cu-Ni Internal Electrodes for Thin-Dielectric MLCC Reliability
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Solution Overview
Problem
As multilayer ceramic capacitors (MLCCs) are miniaturized, internal electrode connectivity and reliability issues arise, leading to compromised high temperature load reliability and moisture resistance, necessitating a solution to enhance these aspects while maintaining high capacitance.
Innovation Solution
The multilayer electronic component incorporates internal electrodes with a controlled Cu/Ni composition, ensuring a coefficient of variation (CV) of 25.0% or less within 5 nm of the dielectric interface, promoting uniform Cu distribution and improved reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If internal electrodes and dielectric layers are reduced in thickness to achieve miniaturization and higher capacitance, then compact size and high capacitance are improved, but internal electrode connectivity deteriorates and manufacturing precision decreases
Solution Approach 1:
The patent applies parameter changes by precisely controlling the Cu/Ni composition ratio in the internal electrode material and managing the coefficient of variation (CV value) of Cu distribution. By optimizing these material parameters, the invention achieves reliable electrode connectivity even with reduced thickness, resolving the contradiction between miniaturization and manufacturing precision.
Solution Approach 2:
The patent uses composite materials by combining Cu and Ni in specific ratios within the internal electrode structure. This composite approach leverages the beneficial properties of both metals: Cu provides high conductivity while Ni offers oxidation resistance and structural stability, thereby maintaining electrode reliability despite thickness reduction.
2Volume of moving object
If internal electrodes and dielectric layers are thinned to achieve miniaturization, then compact size is improved, but high temperature load reliability deteriorates
Solution Approach 1:
The patent controls the Cu content in the internal electrode within a specific range (0.1-5.0 wt%) and manages the CV value of Cu distribution. By optimizing these parameters, the invention enhances high temperature load reliability through improved material composition, allowing thinning without sacrificing thermal stability.
Solution Approach 2:
The patent employs a Cu-Ni composite structure where Cu provides initial conductivity but may oxidize or degrade at high temperatures, while Ni provides long-term structural stability and oxidation resistance. This layered approach uses the shorter-lived Cu for immediate performance and the more stable Ni for long-term reliability under thermal stress.
3Volume of moving object
If internal electrodes and dielectric layers are thinned to achieve miniaturization, then compact size is improved, but moisture resistance reliability deteriorates
Solution Approach 1:
The patent employs a Cu-Ni composite material system where Ni serves as a protective component with excellent corrosion and moisture resistance. The Ni phase forms a stable structure that protects the Cu phase from moisture ingress, thereby maintaining moisture resistance reliability even when the overall electrode thickness is reduced for miniaturization.
Data Source
AI summary
A multilayer electric component includes a body including a dielectric layer and internal electrodes alternately stacked with the dielectric layer interposed therebetween and external electrodes disposed on the body and connected to the internal electrodes, wherein the internal electrodes include Cu and Ni and a coefficient of variation (CV) value of Cu/Ni (percent by weight) in a region thereof, 5 nm deep from an interface with the dielectric layer is 25.0% or less.