Cu-Plated Resin Shielding Housing for Lightweight EMI Control
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Solution Overview
Problem
There is a need to enhance the electromagnetic wave shielding properties of plastic components, which are increasingly replacing metal parts, as existing techniques do not adequately address the requirement for effective shielding.
Innovation Solution
A thermosetting resin composition with a phenol resin as the primary component, combined with a core-shell-type elastomer particle and a plating layer containing a Cu layer with a thickness of 2 μm or more and 30 μm or less, is used to create an electromagnetic shielding housing that achieves a shielding performance of 40 dB or more at a frequency of 10 MHz.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If metal parts are replaced with plastic components, then weight is reduced, but electromagnetic wave shielding performance deteriorates
Solution Approach 1:
The invention uses a composite structure consisting of a plastic resin molded body combined with a plating layer containing conductive particles (such as metal powder). This composite material approach allows the housing to maintain the weight advantages of plastic while achieving electromagnetic wave shielding performance through the conductive plating layer, effectively resolving the contradiction between weight reduction and shielding performance.
2Object-affected harmful factors
If plating processes are applied to resin molded bodies, then electromagnetic wave shielding performance is improved, but manufacturing complexity increases
Solution Approach 1:
The invention modifies the surface properties of the resin molded body by incorporating conductive particles into the plating layer, changing the electrical conductivity parameter of the surface. This allows the non-conductive plastic material to achieve electromagnetic shielding capability without requiring complex multi-step plating processes, thus improving shielding performance while controlling manufacturing complexity.
3Strength
If conventional plating processes are used on plastic surfaces, then adhesion is improved, but shielding performance remains insufficient
Solution Approach 1:
The invention creates a composite plating layer that combines adhesive functionality with electromagnetic shielding capability. The plating layer contains both adhesive components that bond to the resin surface and conductive particles (metal powder) that provide shielding performance. This composite approach allows simultaneous achievement of good adhesion and sufficient electromagnetic wave shielding, resolving the contradiction between these two requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves the electromagnetic wave shielding performance of resin molded bodies, effectively blocking electromagnetic waves and providing a high shielding effectiveness across various frequency ranges.
Implementation Method 1
a plating layer provided on the surface of the cured product, in which the plating layer includes a Cu layer... an electromagnetic wave shielding performance of a structure of the cured product and the plating layer is 40 dB or more at a frequency of 10 MHz
Data Source
AI summary
A housing (121) having an electromagnetic shielding property includes a resin molded body (101), which is a cured product of a thermosetting resin composition, and a plating layer (103) provided on a surface of the resin molded body (101) (cured product), in which the plating layer (103) includes a Cu layer (first plating layer (105)), and a thickness of the Cu layer (first plating layer (105)) is 2 μm or more and 30 μm or less.