Cu-Laminated Resin Current Collector for Low Resistance and Peel Control

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Solution Overview

Problem

Laminated resin films used as current collectors for lithium secondary batteries face issues of high electric resistance, metal layer fracture, and peeling of the metal layer from the resin layer.

Innovation Solution

A Cu film is formed on the surface of a resin layer with specific crystallinity and orientation, characterized by an orientation index of 0.15 or more and a half-width of 0.3° or less in X-ray diffraction measurements, to create a laminated resin film with low electric resistance and improved adhesion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Use of energy by moving object

If a metal layer is formed on the surface of a resin layer to create a current collector, then electrical conductivity is improved, but the metal layer is prone to fracture and peeling

Engineering Contradiction:
Improveelectrical conductivityVSAvoidmetal layer integrity
Core Design Contradiction:
Use of energy by moving objectVSReliability

Solution Approach 1:

The patent changes the crystalline orientation parameters of the Cu film by controlling deposition conditions. Specifically, it achieves a (111) plane orientation index of 0.15 or more and a half-width of 0.3° or less, which fundamentally alters the physical properties of the metal layer to simultaneously improve conductivity and mechanical integrity

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite structure with a resin layer and a Cu film layer with specific crystalline orientation. This composite structure combines the electrical conductivity of metal with the mechanical flexibility and adhesion of the resin, while the specific orientation of the Cu film prevents fracture and peeling

Inventive Principle:
Principle #40Composite materials

2Use of energy by moving object

If a metal layer is formed on the resin layer to reduce electric resistance, then conductivity increases, but the metal layer peels from the resin layer

Engineering Contradiction:
Improveelectric resistanceVSAvoidadhesion between metal layer and resin layer
Core Design Contradiction:
Use of energy by moving objectVSStability of the object's composition

Solution Approach 1:

The patent changes the crystalline orientation parameters of the Cu film by controlling deposition conditions. Specifically, it achieves a (111) plane orientation index of 0.15 or more and a half-width of 0.3° or less, which fundamentally alters the physical properties of the metal layer to simultaneously improve conductivity and mechanical integrity

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent applies different properties to different parts of the metal layer by controlling the crystalline orientation. The (111) plane orientation creates specific local atomic arrangements that enhance both electrical conductivity and interfacial adhesion to the resin layer

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution results in a current collector with low electric resistance, preventing fracture and peeling of the Cu film, leading to a lightweight and safe secondary battery.

Implementation Method 1

in the Cu film, an orientation index of a (111) plane is 0.15 or more according to a Lotgering method, a half-width of an X-ray diffraction peak obtained by X-ray diffraction measurement of the (111) plane is 0.3° or less

Methodology Applied
Scientific EffectCrystallinity: Crystallisation

Data Source

PatentUS20240047696A1Layered resin film, collector, and secondary battery
Publication Date: 2024.02.08 TDK CORP
  • US20240047696A1 patent drawing
  • US20240047696A1 patent drawing

AI summary

A laminated resin film includes: a resin layer; and a Cu film having on one surface or both surfaces of the resin layer, in which in the Cu film, an orientation index of a plane is 0.15 or more according to a Lotgering method, a half-width of an X-ray diffraction peak obtained by X-ray diffraction measurement of the plane is 0.3° or less, and Expression (1) is satisfied.y>3.75x−0.675   Expression (1)(in Expression (1), Y is the orientation index of the plane in the Cu film according to the Lotgering method, and x is the half-width of the X-ray diffraction peak obtained by the X-ray diffraction measurement of the plane in the Cu film.)