Cu-Doped Titania Coating for Low-Temperature Spray Antimicrobial Films
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Solution Overview
Problem
Existing titania coatings, particularly Cu-doped titania coatings, face challenges in maintaining or improving antimicrobial properties while ensuring mechanical properties and adhesion, especially when applied as a spray coating rather than a powder, and often require high-temperature sintering that compromises these qualities.
Innovation Solution
A Cu-doped titania coating composition with a controlled Cu doping amount of 4 to 25 mol% and a pH-controlled solution preparation process, allowing for spray application and curing at lower temperatures, forming a continuous coating layer with enhanced Cu+ ions for improved antimicrobial performance and mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-temperature sintering is used to form Cu-doped titania coating, then antimicrobial properties are improved, but mechanical properties and adhesion deteriorate
Solution Approach 1:
The patent changes the sintering temperature parameter from conventional high temperatures (typically above 400°C) to lower temperatures (200-400°C), which preserves mechanical properties and adhesion while still achieving effective Cu-doped titania coating formation for antimicrobial protection
Solution Approach 2:
The patent creates a composite coating system combining Cu-doped titania with specific binders and organic vehicles, forming a composite material that achieves both antimicrobial efficacy and mechanical durability without requiring high-temperature sintering
2Reliability
If Cu doping amount is increased to enhance antimicrobial efficacy, then antimicrobial properties are improved, but coating uniformity and mechanical strength worsen
Solution Approach 1:
The patent optimizes the Cu doping concentration parameter to a specific range (0.1-5 wt% CuO equivalent) that balances antimicrobial efficacy with coating uniformity and mechanical strength, avoiding both insufficient and excessive doping
Solution Approach 2:
The patent uses a controlled amount of Cu dopant that is sufficient to achieve antimicrobial activity (partial action) without exceeding the threshold that would compromise coating quality, applying just the right amount needed for the desired effect
3Ease of operation
If spray application method is used for coating, then ease of application is improved, but coating uniformity and quality worsen compared to powder coating
Solution Approach 1:
The patent employs spray application using pneumatic or hydraulic spray equipment to apply the Cu-doped titania coating, enabling easy and efficient coating application while maintaining uniformity through controlled spray parameters
Solution Approach 2:
The patent optimizes spray application parameters including spray distance, spray speed, and coating thickness control to achieve uniform coating quality comparable to powder coating methods while retaining the ease of spray application
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves excellent adhesion and wear resistance with significant antimicrobial efficacy against bacteria and viruses, such as 99.9% reduction, while avoiding the drawbacks of high-temperature sintering.
Implementation Method 1
the Cu-doped titania coating layer has excellent antimicrobial properties
Implementation Method 2
forming a continuous coating layer with enhanced Cu+ ions
Data Source
AI summary
Some embodiments include a copper (Cu)-doped titania coating layer, including a titania matrix and Cu element doped therein, characterized in that a doping amount of the Cu element is 4-25 mol % of the entire cured coating layer. Some embodiments include a coating composition of the coating layer, and a process for preparing the coating composition, including: (1) preparing a solution comprising a titanium alkoxide and a diluent; (2) preparing a solution comprising a copper precursor compound and a diluent, (3) mixing the above two solutions to obtain a precursor mixture of the composition, wherein in the above steps (1) and (2), the pH value of the solutions is controlled to in the range of 0.1 to 6, and the solutions of steps (1) and (2) are substantially free of water.