Cube-Textured Metal Foils via Epitaxial Electroforming

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Solution Overview

Problem

The production of cube textured foils, particularly for biaxially textured metal substrates used in high current density HTS wires, is hindered by high costs and long lead times, with existing methods being inefficient and costly.

Innovation Solution

A process involving electroplating an epitaxial layer of an alloy on a cube textured metal foil, followed by the addition of non-epitaxial layers, which replicates the cube texture, allowing for faster production and higher throughput of cube textured foils, including compositions like Ni(1-X-Y)BXCY, where B and C are elements such as W, Mo, or Cr, with X and Y in specific atomic fractions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If traditional thermo-mechanical processes are used to produce cube textured foils, then the foils achieve required texture and quality, but production cost and lead time increase significantly

Engineering Contradiction:
Improvecube texture qualityVSAvoidproduction throughput
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent replaces traditional thermo-mechanical processes (rolling, forging, annealing) with an electrochemical deposition process. The cube textured foil is produced through electroplating or electroforming, where metal ions are deposited onto a substrate under controlled electrical current, achieving the desired cube texture and composition without mechanical deformation or high-temperature heat treatments.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent controls the cube texture and material properties by adjusting electroplating parameters such as current density, electrolyte composition, temperature, and deposition time. By varying these parameters, the process achieves the required texture quality and material composition while maintaining high production speed and low cost.

Inventive Principle:
Principle #35Parameter changes

2Object-affected harmful factors

If additional processing steps are added to produce non-magnetic substrates for AC HTS applications, then magnetic properties are improved, but production complexity and time increase

Engineering Contradiction:
Improvemagnetic propertiesVSAvoidprocessing steps
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent achieves non-magnetic properties by controlling the alloy composition and crystallographic texture through electroplating parameters. By adjusting the electrolyte composition, current density, and deposition conditions, the process produces foils with specific Ni-W alloy ratios and cube texture orientations that inherently minimize magnetic effects, eliminating the need for additional heat treatment or processing steps.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables the production of cube textured foils at a reduced cost and increased performance, suitable for applications in HTS wires, semiconductors, electromagnetic wave detectors, and other technologies, with lengths up to 2 kilometers.

Implementation Method 1

electroplating an epitaxial layer of an alloy on the foil

Methodology Applied
Scientific EffectElectroplating: Electroplating

Implementation Method 2

electroplating an epitaxial layer of an alloy on the cube textured metal foil, whereby the epitaxial layer substantially replicates the cube texture of the metal foil

Methodology Applied
Scientific EffectEpitaxy: Epitaxy

Data Source

PatentUS12635422B2Electro-formed metal foils
Publication Date: 2026.05.19 AMERICAN SUPERCONDUCTOR CORP
  • US12635422B2 patent drawing
  • US12635422B2 patent drawing
  • US12635422B2 patent drawing

AI summary

A process for producing a cube textured foil is described. The process includes providing a cube textured metal foil M. The process further includes electroplating an epitaxial layer of an alloy on the foil M, whereby the epitaxial layer substantially replicates the cube texture of the metal foil M. The process further includes electroplating a non-epitaxial layer of an alloy on the epitaxial layer. The process further includes separating the electroplated alloy from the cube textured metal foil M to obtain an electro-formed alloy with one cube textured surface.