Cubic Zirconia Probe Guide Ceramic for High-Temperature Alignment
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Solution Overview
Problem
IC chips require testing at higher temperatures due to increased current and voltage, leading to thermal expansion mismatches between the wafer and probe guide materials, causing misalignment and operational failures.
Innovation Solution
A ceramic composition with a high thermal expansion coefficient, primarily containing ZrO2 in a cubic crystal structure, stabilized by Y2O3, Al2O3, Si3N4, and BN, with controlled thermal conductivity and bending strength, to maintain alignment and suppress dimensional changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a ceramic with low thermal expansion coefficient (similar to wafer material) is used for the probe guide, then the probe guide material is not prone to thermal expansion, but misalignment occurs between probes and IC chip positions due to thermal expansion mismatch with the wafer
Solution Approach 1:
The patent changes the thermal expansion coefficient parameter of the probe guide material from low (matching wafer) to high (7.0×10^-6/K or higher) to match the thermal expansion characteristics of the wafer material, thereby resolving the alignment mismatch problem that occurs during thermal cycling
2Manufacturing precision
If a ceramic with high thermal expansion coefficient is used for the probe guide, then alignment with IC chips is maintained during thermal expansion, but dimensional changes may occur when high temperatures and stress are repeatedly applied
Solution Approach 1:
The patent employs a composite ceramic material system consisting of ZrO2 (66.5-99.9 mass%) combined with specific additives (Y2O3, CaO, MgO, CeO2, or HfO2 totaling 10-30 mass%, along with optional Al2O3, Si3N4, BN, and other oxides). This composite composition achieves both high thermal expansion coefficient (7.0×10^-6/K or higher) and dimensional stability under repeated thermal stress, resolving the contradiction between alignment precision and reliability
3Strength
If ZrO2 with monoclinic or tetragonal crystal structure is used, then the ceramic has good strength and workability, but dimensional changes occur due to phase transitions under thermal stress
Solution Approach 1:
The patent changes the crystal structure parameter of ZrO2 from monoclinic or tetragonal to cubic structure. The cubic crystal structure eliminates phase transitions that cause dimensional changes, while the specific compositional parameters (ZrO2 content, stabilizer additives) maintain the necessary mechanical strength and workability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ceramic ensures proper contact and alignment of probes with IC chips even at high temperatures, preventing misalignment and operational failures.
Implementation Method 1
the material of the wafer and the material of the probe guide are in an environment where the wafer material is prone to thermal expansion and the probe guide material is not prone to thermal expansion
Implementation Method 2
a crystal structure of the ZrO2 is cubic
Data Source
Figure 1~2
Figure 3~4
AI summary
A ceramic having a chemical composition containing, in terms of mass % on an oxide basis, 66.5% or more ZrO2, and one or more selected from Y2O3, CaO, MgO, CeO2, and HfO2, a total of which is 10 to 30%, wherein a crystal structure of the ZrO2 is cubic.