Cu/Co Coaxial TSV Structure for Millimeter-Wave Loss Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Higher operational frequencies in millimeter wave communication systems lead to increased transmission losses, vulnerability to atmospheric interference, and shorter traveling distances due to the skin effect, which results in significant attenuation and signal degradation.
Innovation Solution
The use of a Cu/Co metaconductor-based coaxial through-substrate-via (cx-TSV) configuration, which suppresses the skin effect and reduces RF resistance by employing a metaconductor with alternating thin layers of non-ferromagnetic and ferromagnetic materials, thereby minimizing signal loss and enhancing electromagnetic interference immunity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If higher operational frequencies are used in millimeter wave communication systems, then data transmission speeds and bandwidth are improved, but transmission losses and signal attenuation are increased due to the skin effect
Solution Approach 1:
The patent applies composite materials by creating a metaconductor structure consisting of alternating layers of ferromagnetic material (e.g., cobalt, nickel, iron) and non-ferromagnetic conductive material (e.g., copper, gold, aluminum). This composite structure with specific layer thicknesses (each layer being a thin film) enables control over the skin effect and RF resistance, achieving reduced transmission loss at millimeter wave frequencies while maintaining high data transmission speeds
Solution Approach 2:
The patent changes physical parameters by controlling the thickness of each layer in the metaconductor structure and the number of alternating layers. By adjusting these parameters, the effective skin depth and RF resistance are optimized for millimeter wave operation, allowing the system to achieve low transmission loss at frequencies of 28 GHz, 35 GHz, 60 GHz, and higher
2Quantity of substance
If higher operational frequencies are used, then bandwidth and capacity are increased, but vulnerability to atmospheric interference and electromagnetic interference is increased
Solution Approach 1:
The alternating ferromagnetic and non-ferromagnetic layers in the metaconductor create a composite structure that provides both electrical conductivity and magnetic properties. This composite configuration reduces electromagnetic interference vulnerability by controlling current distribution and reducing the skin effect, while maintaining the high bandwidth capability required for millimeter wave communication systems
Solution Approach 2:
The metaconductor structure acts as an intermediary between the signal source and the external electromagnetic environment. The alternating material layers serve as a mediator that controls the interaction between the RF signal and electromagnetic interference, reducing the impact of atmospheric interference while preserving signal integrity and bandwidth
3Quantity of substance
If higher operational frequencies are used, then communication capacity is improved, but effective traveling distance is reduced due to increased attenuation
Solution Approach 1:
The metaconductor's composite structure of alternating ferromagnetic and non-ferromagnetic layers reduces the skin effect at high frequencies, thereby reducing attenuation. This enables millimeter wave signals to travel longer distances while maintaining high communication capacity, extending the effective traveling distance beyond what is achievable with conventional conductors at these frequencies
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves a significant reduction in insertion loss and improved signal integrity, allowing for reliable high-frequency performance and efficient data transfer, with a 50% RF resistance reduction at 28 GHz and 70% at 45 GHz, and enhanced electromagnetic interference immunity.
Implementation Method 1
conductor loss is dramatically increased due to the skin effect which is the tendency of high-frequency alternating current to flow in the outermost layer of the conductor
Implementation Method 2
The use of a Cu/Co metaconductor-based coaxial through-substrate-via (cx-TSV) configuration, which suppresses the skin effect and reduces RF resistance by employing a metaconductor with alternating thin layers of non-ferromagnetic and ferromagnetic materials
Data Source
AI summary
The present disclosure describes various embodiments of systems, apparatuses, and related methods for a coaxial through-substrate-via (cx-TSV) based on a Cu/Co metaconductor. One such apparatus comprises a substrate; and a coaxial structure having an outer conductor and a metaconductor for its inner conductor, wherein the coaxial structure extends through the substrate.