Cu-Mn-Sn Resistor Layer Suppresses Thermoelectromotive Force
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Solution Overview
Problem
Existing resistor element manufacturing methods face challenges in achieving high accuracy and low resistance values due to complications in metal formation processes and the high specific resistance and temperature coefficient of resistive materials used in thick film methods, which can lead to errors in resistance values and increased failure rates during trimming processes.
Innovation Solution
A resistor element design incorporating a base substrate with a Cu—Mn—Sn-based composition for the second resistor layer, which suppresses thermoelectromotive force generation during trimming, allowing for precise resistance value control and robustness to temperature changes, while maintaining a low specific resistance value.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If thick film methods are used to manufacture resistor elements, then the manufacturing process becomes less complicated, but the resistance accuracy deteriorates due to high specific resistance and temperature coefficient of resistive materials
Solution Approach 1:
The patent changes the material parameters by using a Cu—Mn—Sn-based composition with specifically controlled composition ratios (Cu: 60-80 at%, Mn: 5-20 at%, Sn: 5-20 at%) to achieve low specific resistance and low temperature coefficient of resistivity, thereby improving resistance accuracy while maintaining thick film manufacturing simplicity
Solution Approach 2:
The patent employs a composite resistive material comprising copper, manganese, and tin in specific proportions to combine the benefits of low specific resistance from copper with low temperature coefficient from manganese and tin, achieving both manufacturing ease and high resistance accuracy
2Ease of manufacture
If thick film methods are used with conventional resistive materials, then manufacturing is simpler, but thermoelectromotive forces occur during trimming processes leading to errors in resistance values
Solution Approach 1:
The patent changes the thermal and electrical parameters of the resistive material by selecting Cu—Mn—Sn-based composition with matched thermal expansion coefficient and low Seebeck coefficient, minimizing thermoelectromotive force generation during trimming operations and improving resistance value reliability
Solution Approach 2:
The patent converts the potential harm of thermoelectromotive force generation during trimming into a benefit by selecting materials with matched thermal properties, where the temperature changes during trimming no longer generate significant thermoelectromotive forces, thereby eliminating the source of error
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resistor element achieves accurate and stable low resistance values with reduced thermoelectromotive force, enhancing manufacturing precision and reducing failure rates by using a Cu—Mn—Sn-based composition with a low temperature coefficient of resistivity and specific resistance.
Implementation Method 1
a resistive material with a low temperature coefficient of resistivity and a low specific resistance value
Data Source
AI summary
A resistor element includes a base substrate having first and second surfaces opposing each other and first and second end surfaces opposing each other and connecting the first and second surfaces. A first resistor layer is on the first surface of the base substrate. First and second terminals are respectively on the first and second end surfaces. A second resistor layer is on the first resistor layer, is connected to the first and second terminals, and includes a copper-manganese-tin (Cu—Mn—Sn)-based composition.