CuNiX-Protected LED Bonding Pads for Oxidation-Resistant Displays
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Solution Overview
Problem
The bonding process of Mini/Micro LEDs and circuit boards on light-emitting substrates faces challenges due to oxidation of pad materials at different temperature conditions, leading to unreliable electrical connections and reduced product yield.
Innovation Solution
A light-emitting substrate with CuNiX oxidation protection layers on pads, which prevents oxidation and ensures reliable bonding by using a CuNiX alloy film deposited through target material sputtering, simplifying the process and improving productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If Cu pads are used for bonding connection, then electrical conductivity is improved, but oxidation resistance deteriorates
Solution Approach 1:
The patent applies composite material structure by combining Cu pads with CuNiX oxidation protection layer. The Cu pad provides excellent electrical conductivity while the CuNiX layer provides oxidation resistance. This composite structure resolves the contradiction between conductivity and oxidation resistance by integrating two materials with complementary properties.
Solution Approach 2:
The CuNiX oxidation protection layer acts as an intermediary between the Cu pad and the oxidizing environment. It serves as a protective barrier that prevents direct contact between oxygen and the Cu pad, thereby maintaining the electrical conductivity of the Cu pad while providing oxidation protection.
2Adaptability or versatility
If multiple bonding processes are performed, then functionality is improved, but process complexity increases
Solution Approach 1:
The CuNiX oxidation protection layer serves multiple functions: it protects Cu pads from oxidation during storage and transport, enables reliable bonding during assembly processes, and maintains electrical conductivity throughout the bonding process. This multi-functionality reduces the need for separate protective measures and simplifies the overall bonding process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The CuNiX oxidation protection layer effectively prevents oxidation at high temperatures, ensuring reliable electrical connections and improving product yield by maintaining the integrity of the pad material, thus enhancing the bonding process between LEDs and circuit boards.
Implementation Method 1
an oxidation protection layer on a side of the plurality of first pads away from the base substrate, where the plurality of first pads are used for bonding connection with a plurality of light-emitting units through the oxidation protection layer
Implementation Method 2
using a CuNiX alloy film deposited through target material sputtering
Data Source
AI summary
A light-emitting substrate and a display device are disclosed, the light-emitting substrate includes: a base substrate including a light-emitting region; a plurality of first pads on a side of the base substrate and in the light-emitting region, where a material of the first pads includes Cu; and an oxidation protection layer on a side of the first pads away from the base substrate, where the plurality of first pads is used for bonding connection with a plurality of light-emitting units through the oxidation protection layer, a material of the oxidation protection layer includes CuNiX, and X includes one or any combination of Al, Sn, Pb, Au, Ag, In, Zn, Bi, Mg, Ga, V, W, Y, Zr, Mo, Nb, Pt, Co or Sb.