CuNO Blackening Layer for Balanced Copper Etching
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Solution Overview
Problem
The existing methods for producing electrical wiring members with copper wiring and blackening layers face issues due to differences in etching rates, leading to imbalanced removal of materials, increased electric resistance, and inadequate suppression of reflection, which complicates the production process and affects the performance of touch panels and electromagnetic shielding members.
Innovation Solution
A method involving the use of CuNO-based blackening layers, which are etched at a rate close to that of copper wiring, ensuring balanced etching and reducing electric resistance, along with the application of a dielectric layer to suppress reflection, achieving a reflectivity of 5% or less across the visible spectrum.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional blackening layers are used with copper wiring, then reflection suppression is achieved, but etching rate imbalance occurs between copper and blackening layer
Solution Approach 1:
The patent applies parameter changes by modifying the chemical composition of the blackening layer to contain copper nitride (Cu3N) or copper oxide nitride (Cu4O3N) phases, which have etching rates matched to copper wiring. This compositional parameter adjustment enables synchronized etching of both layers while maintaining reflection suppression properties.
Solution Approach 2:
The patent uses composite materials by creating a blackening layer with a specific composite structure containing Cu3N and/or Cu4O3N phases combined with copper oxide. This composite material design achieves both etching compatibility with copper wiring and effective light reflection suppression.
2Manufacturing precision
If separate etchants are used for copper wiring and blackening layer, then etching control is improved, but production process complexity increases
Solution Approach 1:
The patent applies universality by developing a blackening layer that can be etched by the same etchant as copper wiring. The Cu3N and/or Cu4O3N-containing blackening layer responds to standard copper etchants, enabling a single etching process to pattern both layers simultaneously, thus simplifying the production process while maintaining precise etching control.
3Reliability
If copper wiring is used instead of transparent conductive materials, then cost and electrical resistance are improved, but reflection increases
Solution Approach 1:
The patent uses composite materials to create a blackening layer with Cu3N and/or Cu4O3N phases that provides superior reflection suppression compared to conventional blackening layers. This composite structure maintains the low electrical resistance benefits of copper wiring while effectively eliminating visible reflection through optimized optical properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures balanced etching of copper and blackening layers, reducing electric resistance and reflection, simplifying the production process and enhancing the performance of electrical wiring members by maintaining line width and suppressing visible radiation reflection effectively.
Implementation Method 1
a method involving the use of CuNO-based blackening layers, which are etched at a rate close to that of copper wiring, ensuring balanced etching
Implementation Method 2
along with the application of a dielectric layer to suppress reflection, achieving a reflectivity of 5% or less across the visible spectrum
Data Source
AI summary
[Object] To provide a method for producing an electrical wiring member having a layered structure of copper wiring and a blackening layer and to provide the electrical wiring member through a search for a material for the blackening layer, the material being etched at a rate close to that for the copper wiring under conditions where etching controllability is ensured. [Solution] A method for producing an electrical wiring member according to the present invention includes a step of forming, on at least one main surface of a substrate, a layered film 6 of a Cu layer 3 and CuNO-based blackening layers (2a and 2b); a step of forming a resist layer 4a in a predetermined region on the layered film 6; and a step of removing a partial region of the layered film 6 by bringing the layered film 6 into contact with an etchant.