Cup Plating Bubble Removal via Paddle-Stirred Ion Resistive Element
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Solution Overview
Problem
Gas bubbles attached to the holes of an ionically resistive element in a cup type plating apparatus can cause deterioration of plating quality on substrates.
Innovation Solution
A plating method involving the use of a paddle to stir the plating solution, alternating directions to accelerate gas bubble removal, and controlled immersion and stirring states to minimize bubble attachment during substrate processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If gas bubbles are present in the plating solution, then the plating solution can be supplied to the substrate, but gas bubbles attach to the ionically resistive element holes and deteriorate plating quality
Solution Approach 1:
The paddle is driven alternately in first and second directions to create periodic stirring action. This periodic motion generates fluid flow that actively removes gas bubbles from the ionically resistive element holes, preventing bubble attachment during plating while maintaining solution supply to the substrate
Solution Approach 2:
The invention uses hydraulic principles by employing a paddle to stir the plating solution, creating fluid motion that generates upward flow. This hydraulic action carries gas bubbles away from the ionically resistive element holes, solving the bubble attachment problem while maintaining solution circulation
2Manufacturing precision
If the paddle stirs the plating solution continuously, then gas bubbles are removed from the ionically resistive element, but waves on the liquid surface cause gas bubbles to attach to the substrate
Solution Approach 1:
The paddle operates with periodic stirring rather than continuous stirring. The alternating drive in first and second directions creates controlled fluid motion that removes bubbles from the ionically resistive element at specific phases, while the periodic nature allows liquid surface stabilization during other phases, preventing substrate bubble attachment
Solution Approach 2:
The stirring system is made dynamic through alternating directional movement. The paddle's motion changes direction periodically, creating adaptable fluid flow patterns that effectively remove bubbles from the ionically resistive element while minimizing surface waves that could transfer bubbles to the substrate
3Speed
If the paddle is positioned above the ionically resistive element, then gas bubbles are accelerated upward, but the substrate must be immersed carefully to avoid wave-induced bubble attachment
Solution Approach 1:
The paddle is positioned specifically above the ionically resistive element to create localized upward fluid flow in that region. This localized stirring action accelerates gas bubbles upward from the holes without creating excessive waves across the entire liquid surface, thereby preventing substrate bubble attachment while maintaining effective bubble removal from the target area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes gas bubbles from the ionically resistive element, suppresses bubble attachment to the substrate, and ensures effective supply of plating solution for uniform film formation.
Implementation Method 1
stirring the plating solution by driving a paddle arranged above the ionically resistive element in a state where the anode and the ionically resistive element are immersed in the plating solution
Implementation Method 2
the stirring of the plating solution with the paddle can accelerate an upward movement of the gas bubbles attached to the hole
Implementation Method 3
performing a plating process on the substrate by flowing electricity between the substrate and the anode
Data Source
AI summary
Provided is a technique that allows removing gas bubbles attached to a hole of an ionically resistive element.A plating method includes: stirring a plating solution by driving a paddle arranged above the ionically resistive element in a state where an anode and the ionically resistive element are immersed in the plating solution (step S20); immersing a substrate as a cathode in the plating solution in a state where the stirring of the plating solution with the paddle is stopped (step S40); resuming the stirring of the plating solution with the paddle arranged above the ionically resistive element and below the substrate in a state where the substrate is immersed in the plating solution (step S50); and performing a plating process on the substrate by flowing electricity between the substrate and the anode in a state where the stirring of the plating solution with the paddle is resumed (step S60).