Curable Composition and Adhesion Layer for Imprint Film Control
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Solution Overview
Problem
Existing imprint techniques face issues with droplets of curable composition spreading too much or shrinking, leading to extrusion and incomplete edge filling defects, which affect productivity and pattern accuracy in semiconductor devices and MEMS fabrication.
Innovation Solution
A material kit comprising a curable composition with specific properties, including a polymerizable compound, photopolymerization initiator, and solvent, along with an adhesion layer to control droplet bonding and prevent excessive spreading or shrinking, ensuring a continuous liquid film formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If droplets of curable composition are discretely dropped onto substrate for imprint technique, then pattern formation is enabled, but droplets spread too much causing extrusion and incomplete edge filling defects
Solution Approach 1:
The patent changes the physical parameters of the curable composition by controlling viscosity (1.3-60 mPa·s at 23°C) and solvent content (5-95 vol%) to achieve optimal balance between spreading control and filling speed. This parameter optimization prevents extrusion while ensuring complete edge filling within acceptable time frames.
Solution Approach 2:
The patent introduces an adhesion layer as an intermediary between the substrate and curable composition. This adhesion layer mediates the interaction by providing controlled wetting properties (contact angle 10-30°) that prevent excessive spreading while enabling complete filling, thus resolving the contradiction between precision and productivity.
2Productivity
If droplets of curable composition are bonded to each other before mold contact, then bubble diffusion time is reduced, but droplets may extrude from desired region
Solution Approach 1:
The patent performs preliminary bonding of droplets to form a continuous liquid film before mold contact. This preliminary action eliminates bubbles that would otherwise remain trapped during molding, improving throughput. The controlled viscosity and adhesion layer properties ensure this bonding occurs without causing extrusion.
Solution Approach 2:
The patent optimizes viscosity (1.3-60 mPa·s) and surface tension parameters to enable droplet bonding while preventing extrusion. The specific viscosity range allows droplets to coalesce into a continuous film quickly (improving productivity) while the adhesion layer controls spreading to prevent encroachment on adjacent regions (maintaining precision).
3Manufacturing precision
If liquid film is formed by bonding droplets, then continuous film is achieved, but liquid film may shrink causing incomplete edge filling
Solution Approach 1:
The adhesion layer acts as an intermediary that prevents liquid film shrinkage by providing controlled wetting properties. With contact angle controlled at 10-30°, the adhesion layer ensures the liquid film maintains sufficient spread to reach mold edges completely, preventing shrinkage-induced incomplete filling while allowing efficient processing.
Solution Approach 2:
The patent changes the surface tension and contact angle parameters through the adhesion layer to prevent liquid film shrinkage. The specific contact angle range (10-30°) provides optimal wetting that prevents shrinkage while maintaining filling efficiency, resolving the contradiction between edge filling completeness and productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient and controlled film formation with reduced extrusion and improved pattern transfer accuracy, enhancing productivity and quality in semiconductor and MEMS manufacturing.
Implementation Method 1
the droplets of the curable composition spread to the whole region of the gap between the substrate and the mold by a capillary phenomenon
Implementation Method 2
the curable composition is irradiated with light to cure the curable composition
Implementation Method 3
a contact angle of the curable composition to the adhesion layer is not more than 1.8°
Data Source
AI summary
A material kit includes a curable composition, and a layer forming composition configured to form an adhesion layer that adheres a substrate and the curable composition. The curable composition contains a polymerizable compound, a photopolymerization initiator, and a solvent. A contact angle of the curable composition to the adhesion layer is not more than 1.8[°], and the contact angle of a composition in a state in which the solvent is removed from the curable composition to the adhesion layer is not less than 11[°] and not more than 19[°].