One-Component Curable Adhesive with Electrochemical Debonding
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Solution Overview
Problem
Existing adhesive compositions are difficult to debond from substrates, as mechanical removal methods damage the substrates, and chemical or high-temperature methods are time-consuming and risky, necessitating the development of a curable, electrochemically debondable adhesive that can be easily disengaged with an electrical potential.
Innovation Solution
A one-component (1K) curable adhesive composition comprising 40-90 wt% ethylenically unsaturated non-ionic monomers, 0.1-30 wt% non-polymerizable electrolytes, 0.1-10 wt% radical generating thermal initiators, and optional fillers and tougheners, which, upon curing, can be debonded by applying a voltage across conductive surfaces, disrupting the adhesive-substrate bond through faradaic reactions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If mechanical removal methods (sand blasting, wire brushing) are used to remove adhesive, then adhesive can be removed, but substrate surfaces are damaged and machining costs increase
Solution Approach 1:
The patent replaces mechanical removal methods with electrochemical debonding. The adhesive composition contains ionic compounds that enable electrochemical reactions when voltage is applied, causing the adhesive to decompose and detach from substrates through faradaic reactions rather than mechanical force, thereby eliminating substrate damage from mechanical abrasion
Solution Approach 2:
The patent changes the chemical composition parameters of the adhesive by incorporating specific ionic compounds (melting point ≤120°C) into the adhesive matrix. This compositional modification enables the adhesive to undergo electrochemical transformations under applied voltage, transitioning from a mechanically bonded state to a chemically debonded state without damaging substrates
2Ease of operation
If chemical or high temperature methods are used to disassemble adhesive bonds, then adhesive can be debonded, but the process is time consuming and complex
Solution Approach 1:
The patent replaces slow thermal and chemical debonding processes with electrochemical debonding. The ionic compounds in the adhesive enable rapid faradaic reactions when voltage is applied, causing quick adhesive decomposition and substrate separation, significantly reducing debonding time compared to conventional methods
Solution Approach 2:
The adhesive composition is designed to self-decompose through electrochemical reactions when voltage is applied. The ionic compounds within the adhesive matrix facilitate self-catalyzed decomposition reactions, eliminating the need for external chemicals or prolonged heating processes, thereby accelerating the debonding operation
3Ease of operation
If chemical or high temperature methods are used to debond adhesive, then adhesive bond can be disrupted, but substrates are damaged and become unsuitable for subsequent applications
Solution Approach 1:
The patent replaces aggressive chemical and thermal debonding methods with electrochemical debonding. The electrochemical reactions occur primarily within the adhesive matrix itself, causing localized decomposition at the adhesive-substrate interface without exposing substrates to damaging chemicals or high temperatures, thereby preserving substrate integrity for subsequent applications
Solution Approach 2:
The ionic compounds in the adhesive composition act as intermediaries that facilitate debonding reactions. These ionic compounds undergo electrochemical transformations that generate decomposition products localized at the adhesive-substrate interface, mediating the separation process in a way that protects substrates from direct exposure to harsh debonding conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively weakens the adhesive bond by at least 50% upon application of a 30V electrical potential, allowing for easy removal without damaging the substrates, as demonstrated by tensile lap shear tests, indicating improved debonding efficiency and substrate protection.
Implementation Method 1
a one-component (1K) curable adhesive composition based on (meth)acrylate monomers
Implementation Method 2
sufficient ion conductive properties to enable a weakening of said adhesive bond at the application of a voltage across the adhesive composition
Implementation Method 3
disrupting the bonding at the interface of the adhesive and the substrate through faradaic reactions
Data Source
AI summary
The present invention is directed to a curable and electrochemically debondable one-component (1K) adhesive composition comprising, based on the weight of the composition:from 40 to 90 wt. % of i) at least one ethylenically unsaturated non-ionic monomer;from 1 to 30 wt. % of ii) non-polymerizable electrolyte;from 0.1 to 10 wt. % of iii) at least one radical generating thermal initiator;from 0 to 20 wt. % of iv) filler; and,from 0 to 20 wt. % of v) toughener.