Pressure-Sensitive Curable Adhesive Layer Bonding Method
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Solution Overview
Problem
The existing two-component adhesive method requires individual weighing and mixing of main components and curing agents immediately before use, making the process complicated and time-consuming.
Innovation Solution
An adhesion method involving a pressure-sensitive curable adhesive layer with a solid and liquid epoxy resin composition on one adherend and a curing agent layer containing an imidazole compound on another adherend, allowing them to react at normal temperature without the need for individual weighing and mixing, forming a strong bond.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a two-component adhesive method is used with individual weighing and mixing of main component and curing agent, then strong adhesion can be achieved, but the bonding process becomes complicated and time-consuming
Solution Approach 1:
The patent combines the main component (pressure-sensitive curable adhesive layer) and curing agent (curing agent layer) into separate but integrated layers that are disposed on adherends before bonding. This merging eliminates the need for separate weighing and mixing steps while ensuring proper contact and reaction, thus simplifying the bonding process without compromising adhesion strength.
Solution Approach 2:
The patent prepares the pressure-sensitive curable adhesive layer and curing agent layer in advance and disposes them on the adherends before the bonding operation. This preliminary action eliminates the need for immediate weighing and mixing during the bonding process, reducing complexity and time requirements while ensuring the components are ready for reaction upon contact.
2Manufacturing precision
If individual weighing and mixing of adhesive components is performed immediately before use, then proper mixing ratio can be ensured, but the process becomes more time-consuming
Solution Approach 1:
The patent prepares the pressure-sensitive curable adhesive layer and curing agent layer in advance with controlled compositions, disposing them on adherends before bonding. This preliminary preparation ensures proper mixing ratios are achieved through controlled layer formation rather than immediate mixing, reducing preparation time while maintaining precision.
Solution Approach 2:
The patent segments the adhesive system into distinct layers (pressure-sensitive curable adhesive layer and curing agent layer) that are applied separately and then brought into contact. This segmentation allows each layer to be prepared independently with controlled composition, ensuring proper mixing ratios without requiring simultaneous weighing and mixing operations.
3Reliability
If heating is applied to cure the adhesive layer, then curing can be achieved, but the process requires additional equipment and energy
Solution Approach 1:
The patent employs a self-service curing mechanism where the curing agent layer reacts with the pressure-sensitive curable adhesive layer upon contact to cure the adhesive without requiring external heating. This self-service approach eliminates the need for heating equipment and energy input, simplifying the curing process while maintaining effectiveness through the chemical reaction between the imidazole compound and epoxy resin.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the bonding process by eliminating the need for immediate mixing and heating, achieving strong adhesion between adherends with improved peel adhesion and lap-shear strength.
Implementation Method 1
the curing agent layer is able to cure the pressure-sensitive curable adhesive layer by contacting and reacting with the pressure-sensitive curable adhesive layer
Data Source
Figure 1A~1B
Figure 2A~2D
Figure 3A~3C
AI summary
An adhesion method including: a step (1), disposing a stickable-curable adhesive layer on a first adherend; a step (2), disposing a curing agent layer on a second adherend, the curing agent layer being able to cure the stickable-curable adhesive layer by contacting and reacting with the stickable-curable adhesive layer; and a step (3), bringing the stickable-curable adhesive layer into contact with the curing agent layer so that they are sandwiched by the first adherend and the second adherend.