Curable Adhesive Precursor for Hem Flange Bonding

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Solution Overview

Problem

Current structural adhesive compositions for bonding metal parts in the automotive industry face challenges such as insufficient elasticity, tackiness, and corrosion resistance, particularly in hem flange bonding applications, where they often require additional sealing materials and exhibit suboptimal performance attributes like adhesive strength and stability.

Innovation Solution

A curable precursor composition combining a thermally curable resin, a thermal curing initiator, a radiation self-polymerizable multi-functional compound with a polyether oligomeric backbone, and a free-radical polymerization initiator, which undergoes a dual curing system involving both thermal and radiation-induced polymerization to form an interpenetrating network, providing enhanced elasticity, tackiness, and corrosion resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If structural adhesive films are used for hem flange bonding, then bonding capability is provided, but lack of elasticity and insufficient tackiness results in only partial suitability

Engineering Contradiction:
Improveadhesive strengthVSAvoidelasticity and tackiness
Core Design Contradiction:
StrengthVSAdaptability or versatility

Solution Approach 1:

The patent combines a thermally curable resin (epoxy) with a radiation-curable polymerizable compound to create a hybrid adhesive composition. This composite material integrates the high strength of thermosetting adhesives with the elasticity and tackiness of radiation-cured polymers, achieving both strong bonding and improved adaptability for hem flange applications

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent modifies the chemical composition parameters by incorporating specific ratios of thermally curable resin to polymerizable compound, and by selecting appropriate initiators and catalysts. This parameter optimization enables the adhesive to achieve both high adhesive strength and sufficient elasticity/tackiness for complex geometries

Inventive Principle:
Principle #35Parameter changes

2Strength

If conventional adhesives are used for metal panel bonding, then bonding is achieved, but additional sealing materials are required, increasing complexity

Engineering Contradiction:
Improvebonding capabilityVSAvoidnumber of materials required
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent develops a universal adhesive composition that simultaneously provides bonding, sealing, and corrosion resistance functions. The hybrid formulation creates an impervious barrier upon curing that eliminates the need for separate sealants, reducing material complexity while maintaining comprehensive protective functionality

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges previously separate functions (bonding and sealing) into a single adhesive composition. By integrating sealing agents and corrosion inhibitors into the hybrid adhesive matrix, the system consolidates multiple material layers into one multi-functional product

Inventive Principle:
Principle #5Merging (Combining)

3Strength

If structural adhesives are used for metal joints, then bonding strength is achieved, but corrosion resistance is insufficient, requiring further sealing

Engineering Contradiction:
Improvemechanical strengthVSAvoidcorrosion resistance
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent incorporates corrosion-resistant additives and sealing agents into the hybrid adhesive composition, creating a composite material that provides both mechanical strength and corrosion protection. The radiation-curable polymer matrix forms a chemically resistant barrier that protects metal substrates from environmental degradation

Inventive Principle:
Principle #40Composite materials

4Strength

If thermally curable adhesives are used, then high strength bonding is achieved, but processing flexibility and handling properties are suboptimal

Engineering Contradiction:
Improvebonding strengthVSAvoidhandling properties
Core Design Contradiction:
StrengthVSEase of operation

Solution Approach 1:

The patent applies the adhesive in a partially cured state through radiation curing, which provides preliminary bonding and allows for positioning adjustments before final thermal curing. This staged approach improves handling properties during assembly while maintaining the option for high-strength final bonding

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The hybrid curing system achieves excellent adhesive strength, stability, and corrosion resistance, enabling efficient bonding of metal parts with improved handling properties and flexibility, suitable for complex geometries and oily contaminated substrates, while eliminating the need for additional sealing materials.

Implementation Method 1

a thermally curable resin; b) a thermal curing initiator for the thermally curable resin

Methodology Applied
Scientific EffectThermal polymerization: Photopolymerisation

Implementation Method 2

a radiation self-polymerizable multi-functional compound comprising a polyether oligomeric backbone and at least one free-radical (co)polymerizable reactive group at each terminal position of the oligomer backbone; d) a free-radical polymerization initiator for the radiation self-polymerizable multi-functional compound

Methodology Applied
Scientific EffectRadiation-induced polymerization: Photopolymerisation

Data Source

PatentUS20230235204A1Curable precursor of a structural adhesive composition
Publication Date: 2023.07.27 3M INNOVATIVE PROPERTIES CO
  • US20230235204A1 patent drawing
  • US20230235204A1 patent drawing
  • US20230235204A1 patent drawing

AI summary

The present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a thermally curable resin; a thermal curing initiator for the thermally curable resin; a radiation self-polymerizable multi-functional compound comprising a polyether oligomeric backbone and at least one free-radical (co)polymerizable reactive group at each terminal position of the oligomer backbone; and a free-radical polymerization initiator for the radiation self-polymerizable multi-functional compound.