Curable Adhesive Precursor for Thermal Conductivity and Workability
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Solution Overview
Problem
Existing thermally-conductive curable compositions face challenges in achieving good workability and processability in their uncured state while providing excellent thermal conductivity, adhesion, and mechanical properties in their fully cured state.
Innovation Solution
A curable precursor comprising a (meth)acrylate-based (co)polymer base component, a crosslinker with acid-functional groups derived from phosphoric acid, a polyether oligomer with a number average molecular weight of at least 2000 g/mol, and thermally conductive particulate material, which together provide unique rheological and curing characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermally conductive particulate material is added to curable compositions, then thermal conductivity is improved, but rheological characteristics and workability deteriorate
Solution Approach 1:
The patent employs silane-modified polyether oligomers as intermediary substances that mediate between the thermally conductive particulate material and the (meth)acrylate-based polymer matrix. These oligomers with specific molecular weights (200-2000 g/mol) act as coupling agents that improve dispersion of the thermal conductive particles while maintaining suitable rheological properties, thus resolving the contradiction between enhanced thermal conductivity and preserved workability.
Solution Approach 2:
The patent systematically optimizes multiple parameters including the molecular weight of polyether oligomers (200-2000 g/mol), the ratio of thermally conductive particulate material (30-90 wt%), and the composition of (meth)acrylate-based polymers. By adjusting these parameters within specific ranges, the formulation achieves both high thermal conductivity and acceptable rheological characteristics for practical application.
2Temperature
If high loading of thermally conductive particulate material is used, then thermal conductivity is improved, but adhesion and mechanical properties worsen
Solution Approach 1:
The patent creates a composite material system consisting of (meth)acrylate-based polymers, silane-modified polyether oligomers, and thermally conductive particulate materials. This multi-component composite structure allows the polyether oligomers to form a flexible matrix that binds the rigid thermal conductive particles while maintaining adhesion to substrates, thus achieving high thermal conductivity without sacrificing mechanical strength.
Solution Approach 2:
The patent applies local quality by having different components serve different functions: the (meth)acrylate-based polymers provide structural framework and adhesion, the silane-modified polyether oligomers provide flexibility and particle dispersion, and the thermally conductive particles provide thermal conductivity. This functional differentiation allows each component to optimize its local role, achieving high thermal conductivity while maintaining overall mechanical integrity.
3Temperature
If curable compositions are formulated for excellent thermal conductivity, then thermal management performance is improved, but curing profile and processability become more difficult to control
Solution Approach 1:
The patent utilizes the dual-cure mechanism of silane-modified polyether oligomers, which can cure through both moisture curing and (meth)acrylate-based polymerization. By controlling the molecular weight (200-2000 g/mol) and silane content of the oligomers, the formulation achieves可控 curing profiles that can be adjusted according to application requirements, making the curing process more manageable despite high thermal conductivity requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curable precursor exhibits excellent adhesion, thermal conductivity, and mechanical properties in its fully cured state, while maintaining outstanding workability and processability in its uncured state, making it suitable for thermal management applications in the automotive industry.
Implementation Method 1
a (meth)acrylate-based (co)polymer base component comprising the free-radical (co)polymerization reaction product of a (co)polymerizable material
Implementation Method 2
a crosslinker for the (meth)acrylate-based (co)polymer base component, which comprises at least one acid-functional group derived from phosphoric acid and at least one free-radical (co)polymerizable reactive group
Implementation Method 3
a thermally conductive particulate material
Data Source
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AI summary
The present disclosure relates to a curable precursor of an adhesive composition, comprising: a) a (meth)acrylate-based (co)polymer base component comprising the free-radical (co)polymerization reaction product of a (co)polymerizable material comprising: i. C1-C32 acrylic acid ester monomer units; ii. optionally, C1-C18 methacrylic acid ester monomer units; and iii. optionally, ethylenically unsaturated monomer units having a functional group and which are copolymerizable with monomer units (i) and/or (ii); b) a crosslinker for the (meth)acrylate-based (co)polymer base component, which comprises at least one acid-functional group derived from phosphoric acid and at least one free-radical (co)polymerizable reactive group; c) a polyether oligomer having a number average molecular weight of at least 2000 g/mol and which comprises at least one free-radical (co)polymerizable reactive group; and d) a thermally conductive particulate material. According to another aspect, the present disclosure is directed to a curing system suitable for such curable precursor. According to still another aspect, the present disclosure relates to a method of manufacturing such curable precursor. In yet another aspect, the disclosure relates to the use of such curable precursor for industrial applications, in particular for thermal management applications in the automotive industry.