Curable Adhesive Compound with Improved Stampability and Shock Properties
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Solution Overview
Problem
Curable adhesives with high mass fractions of reactive resin exhibit inadequate processing properties, such as low cohesion and poor adhesion to rough surfaces, leading to cohesive failures and residue issues, while attempts to improve cohesion often compromise handling and adhesive strength.
Innovation Solution
A curable adhesive composition featuring a combination of (meth)acrylate block copolymers with specific glass transition temperatures and epoxy compounds, including solid and liquid epoxy components, to achieve enhanced cohesion, flow behavior, and shock resistance without the need for polyols.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high mass fractions of reactive resin are used to ensure sufficient curability, then the curability of the adhesive is improved, but the cohesion and processing properties of the adhesive deteriorate
Solution Approach 1:
The patent changes the physical state parameter of the reactive resin from liquid to solid, and adjusts the mass fraction range to 5-30%. This parameter change allows maintaining sufficient curability while improving cohesion and processing properties, as solids provide better structural integrity and reduced viscosity compared to high concentrations of liquid resins
Solution Approach 2:
The patent creates a composite adhesive system combining solid reactive resin with specific polymer additives and curing agents. This composite approach enables the adhesive to achieve both curability and cohesion by leveraging the complementary properties of different materials working together
2Reliability
If high mass fractions of reactive resin are used to ensure sufficient curability, then the curability of the adhesive is improved, but the processing properties and flow behavior deteriorate
Solution Approach 1:
The patent changes the physical state of the reactive resin from liquid to solid, which fundamentally alters the flow behavior and processing characteristics. Solid reactive resin provides better processability by reducing excessive viscosity while maintaining curability, allowing for easier application and better adaptation to substrate surfaces
3Strength
If measures are taken to increase cohesion of the curable adhesive, then the cohesion is improved, but the handling properties and adhesive strength deteriorate
Solution Approach 1:
The patent uses parameter changes by controlling the physical state (solid vs. liquid) and adjusting the mass fraction of reactive resin to achieve an optimal balance. This allows the adhesive to have sufficient cohesion for strong bonding while maintaining adequate flow behavior and handling properties for proper application
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition demonstrates improved cohesion, flow behavior, and shock resistance, allowing for effective adhesion to rough surfaces and easy removal without residue, while maintaining good handling properties.
Implementation Method 1
the crosslinking reaction can be triggered by external factors, for example, by the application of energy, in particular by temperature, plasma, or radiation curing
Implementation Method 2
adhesive tapes are an alternative to the use of formless adhesives, which are applied from a tube, for example
Data Source
AI summary
The invention relates to a curable adhesive, comprising, based on the mass of the curable adhesive: a) one or more (meth)acrylate block copolymers of structure ABA in a combined mass fraction of 25% or more, wherein the A-blocks independently represent a poly(meth)acrylate with a glass transition temperature Tg of 50 °C or more, which can be produced by polymerizing an A-monomer composition from A-monomers, and wherein the B-block represents a poly(meth)acrylate with a glass transition temperature Tg of less than 50 °C, which can be produced by polymerizing a B-monomer composition from B-monomers; b) one or more polymerizable first epoxy compounds E1 in a combined mass fraction of 5% or more, wherein the first epoxy compound E1 is a solid or a highly viscous substance at 25 °C; and c) one or more polymerizable second epoxy compounds E2 in a combined mass fraction of 5% or more,wherein the second epoxy compound E2 is a liquid at 25 °C, wherein the molar-weighted polar component of the Hansen solubility parameters <δp> of the monomer units derived from A monomers in the A blocks <δp>(A) is in the range of 9.0 to 11.0 MPa0.5, and wherein the molar-weighted polar component of the Hansen solubility parameters <δp> of the monomer units derived from B monomers in the B blocks <δp>(B) is less than 9 MPa0.5.