Curable Adhesive for Multilayered Wiring Boards
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Solution Overview
Problem
The production of multilayered wiring boards is hindered by lengthy processes, high energy costs, and environmental loads, particularly due to the complexity of producing conductive through holes and solder reflow, while requiring reliable connectivity under high-temperature and high-humidity conditions.
Innovation Solution
A method involving a curable adhesive composition with specific thermal expansion and glass transition temperature properties, combined with conductive particles, is used to connect wiring members through heating and pressurization, ensuring efficient and reliable bonding between electrodes, thereby simplifying the production process and maintaining connectivity under challenging conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional processes such as conductive through hole production and solder reflow are used, then connectivity is ensured, but process time and energy cost increase
Solution Approach 1:
The patent combines the bonding function and conductive connection function into a single adhesive composition. The adhesive contains both bonding agents for joining wiring members and conductive particles for electrical connection, eliminating the need for separate conductive through hole production and soldering processes. This merging of functions directly reduces process time while maintaining connectivity reliability.
Solution Approach 2:
The adhesive composition serves multiple functions simultaneously: it bonds wiring members together, provides electrical conductivity for connection, and forms a protective matrix. This multi-functional adhesive replaces multiple specialized processes (bonding, conductive filling, soldering), reducing overall process time while ensuring reliable connectivity.
2Reliability
If conventional processes such as conductive through hole production and solder reflow are used, then connectivity is ensured, but energy cost increases
Solution Approach 1:
The patent combines the bonding function and conductive connection function into a single adhesive composition. The adhesive contains both bonding agents for joining wiring members and conductive particles for electrical connection, eliminating the need for separate conductive through hole production and soldering processes. This merging of functions directly reduces process time while maintaining connectivity reliability.
Solution Approach 2:
The adhesive composition serves multiple functions simultaneously: it bonds wiring members together, provides electrical conductivity for connection, and forms a protective matrix. This multi-functional adhesive replaces multiple specialized processes (bonding, conductive filling, soldering), reducing overall process time while ensuring reliable connectivity.
3Reliability
If conventional processes such as conductive through hole production and solder reflow are used, then connectivity is ensured, but environmental load increases
Solution Approach 1:
The patent combines the bonding function and conductive connection function into a single adhesive composition. The adhesive contains both bonding agents for joining wiring members and conductive particles for electrical connection, eliminating the need for separate conductive through hole production and soldering processes. This merging of functions directly reduces process time while maintaining connectivity reliability.
Solution Approach 2:
The adhesive composition serves multiple functions simultaneously: it bonds wiring members together, provides electrical conductivity for connection, and forms a protective matrix. This multi-functional adhesive replaces multiple specialized processes (bonding, conductive filling, soldering), reducing overall process time while ensuring reliable connectivity.
4Loss of time
If simple lamination and pressing is used, then process time is reduced, but connectivity under high-temperature and high-humidity conditions may be compromised
Solution Approach 1:
The patent carefully controls the particle size distribution of conductive particles within specific ranges (0.01-10 μm average diameter) and adjusts their content (1-50 parts by mass per 100 parts of adhesive composition). These parameter optimizations ensure adequate conductivity while maintaining bonding strength and reliability under high-temperature and high-humidity conditions, achieving both fast processing and high reliability.
Solution Approach 2:
The adhesive composition is a composite material containing bonding agents (epoxy resin, phenolic resin, or polyimide resin), conductive particles (metal or carbon-based), and optional fillers. This composite structure provides simultaneous bonding strength, electrical conductivity, and environmental reliability, enabling simple lamination and pressing to achieve both speed and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for rapid, low-energy, and environmentally friendly production of multilayered wiring boards with reliable connectivity under high-temperature and high-humidity conditions, simplifying the production process while ensuring the integrity of the bonding between wiring members.
Implementation Method 1
a curable adhesive composition used for bonding a wiring member constituting a multilayered wiring board... a step of heating and pressurizing... to electrically connect the first electrode portion and the second electrode portion
Implementation Method 2
a filmy adhesive containing conductive particles and a curable adhesive composition in a state where the first electrode portion and the second electrode portion are disposed to face each other with the filmy adhesive interposed therebetween, to electrically connect the first electrode portion and the second electrode portion
Implementation Method 3
a step of heating and pressurizing a first wiring member having a first electrode portion on a surface thereof, a second wiring member having a second electrode portion on a surface thereof
Implementation Method 4
a step of heating and pressurizing a first wiring member having a first electrode portion on a surface thereof, a second wiring member having a second electrode portion on a surface thereof
Data Source
AI summary
A curable adhesive composition used for bonding a wiring member constituting a multilayered wiring board, in which the curable adhesive composition satisfies all the following conditions (A) and (B) when a thermal expansion coefficient and a glass transition temperature of a cured product are designated as CTE0 (ppm/° C.) and Tg0 (° C.), respectively:(A) 5≤CTE0≤270(B) 140≤Tg0≤280