Curable Composition Cleaning for Particle Removal on Delicate Substrates
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Solution Overview
Problem
Conventional cleaning methods for semiconductor substrates and MEMS devices struggle to effectively remove small foreign particles without damaging microstructures or causing re-adhesion, and incur high environmental and cost burdens due to chemical usage.
Innovation Solution
A dry cleaning method using a curable composition that entraps foreign particles, controlled by considering cure shrinkage, to be separated after curing, minimizing damage to the substrate and template.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If hydrodynamic force is increased to remove small foreign particles, then foreign particle removal efficiency is improved, but microstructure damage occurs
Solution Approach 1:
A curable composition is introduced as an intermediary substance between the cleaning apparatus and the substrate. This composition fills the space between protrusions, allowing foreign particles to be entrapped during curing without requiring direct high-force contact that would damage microstructures.
Solution Approach 2:
The cleaning mechanism transitions from mechanical force-based to chemistry-based by utilizing the curing process of the composition. The composition's physical state changes from liquid to solid during curing, enabling particle entrapment without applying damaging mechanical stress to the substrate.
2Productivity
If chemical solution is used to remove foreign particles, then foreign particle removal is achieved, but environmental load and cost burden increase
Solution Approach 1:
The invention converts the typically harmful chemical cleaning process into a beneficial one by using a curable composition that solidifies to trap particles. The cured composition can be easily removed without chemical waste, transforming the harmful chemical cleaning approach into an environmentally friendly process.
3Productivity
If cure shrinkage of composition is not considered, then foreign particle entrapment is achieved, but member damage occurs
Solution Approach 1:
The supply amount of the curable composition is predetermined and controlled in advance based on the expected cure shrinkage rate. This preliminary calculation ensures that after shrinkage during curing, the composition maintains appropriate thickness to entrap particles while avoiding excessive pressure that would damage the substrate.
4Productivity
If supply amount of composition is not controlled, then foreign particle entrapment is achieved, but substrate and template damage occur
Solution Approach 1:
The system incorporates feedback control where the supply amount of composition is adjusted based on measured or estimated parameters such as cure shrinkage rate, substrate properties, and template characteristics. This closed-loop control optimizes the balance between particle entrapment effectiveness and prevention of damage to sensitive components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Efficient removal of small foreign particles with reduced substrate and template damage, improving throughput and reducing environmental and cost impacts.
Implementation Method 1
curing the composition on the first member after the pressing, in a state in which the composition and the second member are in contact with each other
Data Source
AI summary
The present invention provides a method of removing a foreign particle on a first member, comprising: supplying a composition on the first member; pressing a second member against the composition supplied on the first member; curing the composition on the first member after the pressing; and separating the second member together with the composition from the first member, after the curing, wherein in the supplying, a supply amount of the composition to be supplied on the first member is controlled based on a cure shrinkage rate of the composition in the curing and an estimated size of a foreign particle being presumably adhered on the first member, such that a thickness of a portion of the composition cured in the curing, which exists between the second member and the first member, becomes larger than the estimated size.


