Curable Composition Cleaning for Particle Removal on Delicate Substrates

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Solution Overview

Problem

Conventional cleaning methods for semiconductor substrates and MEMS devices struggle to effectively remove small foreign particles without damaging microstructures or causing re-adhesion, and incur high environmental and cost burdens due to chemical usage.

Innovation Solution

A dry cleaning method using a curable composition that entraps foreign particles, controlled by considering cure shrinkage, to be separated after curing, minimizing damage to the substrate and template.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If hydrodynamic force is increased to remove small foreign particles, then foreign particle removal efficiency is improved, but microstructure damage occurs

Engineering Contradiction:
Improveforeign particle removal efficiencyVSAvoidmicrostructure damage
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

A curable composition is introduced as an intermediary substance between the cleaning apparatus and the substrate. This composition fills the space between protrusions, allowing foreign particles to be entrapped during curing without requiring direct high-force contact that would damage microstructures.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The cleaning mechanism transitions from mechanical force-based to chemistry-based by utilizing the curing process of the composition. The composition's physical state changes from liquid to solid during curing, enabling particle entrapment without applying damaging mechanical stress to the substrate.

Inventive Principle:
Principle #35Parameter changes

2Productivity

If chemical solution is used to remove foreign particles, then foreign particle removal is achieved, but environmental load and cost burden increase

Engineering Contradiction:
Improveforeign particle removal capabilityVSAvoidenvironmental load and waste liquid treatment
Core Design Contradiction:
ProductivityVSObject-generated harmful factors

Solution Approach 1:

The invention converts the typically harmful chemical cleaning process into a beneficial one by using a curable composition that solidifies to trap particles. The cured composition can be easily removed without chemical waste, transforming the harmful chemical cleaning approach into an environmentally friendly process.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

3Productivity

If cure shrinkage of composition is not considered, then foreign particle entrapment is achieved, but member damage occurs

Engineering Contradiction:
Improveforeign particle entrapmentVSAvoidmember damage
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The supply amount of the curable composition is predetermined and controlled in advance based on the expected cure shrinkage rate. This preliminary calculation ensures that after shrinkage during curing, the composition maintains appropriate thickness to entrap particles while avoiding excessive pressure that would damage the substrate.

Inventive Principle:
Principle #10Preliminary action

4Productivity

If supply amount of composition is not controlled, then foreign particle entrapment is achieved, but substrate and template damage occur

Engineering Contradiction:
Improveforeign particle entrapment efficiencyVSAvoidsubstrate and template integrity
Core Design Contradiction:
ProductivityVSStrength

Solution Approach 1:

The system incorporates feedback control where the supply amount of composition is adjusted based on measured or estimated parameters such as cure shrinkage rate, substrate properties, and template characteristics. This closed-loop control optimizes the balance between particle entrapment effectiveness and prevention of damage to sensitive components.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Efficient removal of small foreign particles with reduced substrate and template damage, improving throughput and reducing environmental and cost impacts.

Implementation Method 1

curing the composition on the first member after the pressing, in a state in which the composition and the second member are in contact with each other

Methodology Applied
Scientific EffectCuring: Photopolymerisation

Data Source

PatentUS12453991B2Foreign particle removing method, formation method, article manufacturing method, foreign particle removing apparatus, and system
Publication Date: 2025.10.28 CANON KK
  • US12453991B2 patent drawing
  • US12453991B2 patent drawing
  • US12453991B2 patent drawing

AI summary

The present invention provides a method of removing a foreign particle on a first member, comprising: supplying a composition on the first member; pressing a second member against the composition supplied on the first member; curing the composition on the first member after the pressing; and separating the second member together with the composition from the first member, after the curing, wherein in the supplying, a supply amount of the composition to be supplied on the first member is controlled based on a cure shrinkage rate of the composition in the curing and an estimated size of a foreign particle being presumably adhered on the first member, such that a thickness of a portion of the composition cured in the curing, which exists between the second member and the first member, becomes larger than the estimated size.