Curable Composition for Low-Temperature Curing in Air
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Solution Overview
Problem
Existing curable compounds, such as those with a PEEK skeleton, are difficult to dissolve in solvents and require high temperatures or a nitrogen atmosphere for curing due to oxygen deactivation by peroxides, limiting their workability and applicability in air environments.
Innovation Solution
A curable composition comprising a specific compound represented by Formula (1) and a curing accelerator, such as a quaternary phosphonium salt, allows for curing at low temperatures in the presence of oxygen, enhancing solvent solubility and workability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a peroxide is used as a curing agent to achieve low-temperature curing, then the curing temperature can be reduced, but the curing cannot proceed stably in the presence of oxygen due to peroxide deactivation
Solution Approach 1:
The patent introduces a specific curing accelerator (compound with formula (2) where R1 is hydrogen or methyl, R2 is hydrogen or methyl, and R3 is an aromatic hydrocarbon group) as an intermediary substance that mediates between the peroxide curing agent and oxygen environment. This accelerator protects the peroxide from oxygen deactivation while enabling low-temperature curing to proceed stably in air atmosphere, thus resolving the contradiction between low curing temperature and curing stability in oxygen.
2Strength
If polyimide or PEEK is used to achieve high heat resistance and mechanical properties, then the performance is enhanced, but the difficulty in dissolving in solvent and melting increases
Solution Approach 1:
The patent creates a composite curable composition combining polyimide or PEEK base resin with specific curing agents (peroxide) and curing accelerators (compound of formula (2)). This composite formulation enables the high-performance engineering plastic to be processed at lower temperatures with improved solvent solubility, while maintaining the excellent heat resistance and mechanical properties of the base material after curing.
Solution Approach 2:
The patent changes the curing parameters by introducing a specific curing accelerator that enables curing at lower temperatures than conventional methods. The accelerator modifies the reaction kinetics, allowing the polymerization to proceed effectively at reduced temperatures, thus improving ease of manufacture while preserving the high-performance characteristics of polyimide or PEEK.
3Reliability
If no peroxide is used as curing agent to avoid oxygen deactivation, then curing can proceed in air atmosphere, but high temperature treatment of 300°C or more is required
Solution Approach 1:
The patent uses the curing accelerator (compound of formula (2)) as a mediator that enables peroxide-based low-temperature curing to function reliably in air atmosphere. The accelerator protects the peroxide from oxygen deactivation, allowing the system to achieve both low curing temperature and stability in oxygen environment simultaneously.
Solution Approach 2:
The patent changes the chemical parameters of the curing system by introducing the specific curing accelerator, which modifies the reaction mechanism to be oxygen-tolerant. This parameter change allows the curing process to proceed at low temperatures even in the presence of oxygen, overcoming the limitation of conventional peroxide systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curable composition achieves stable curing at low temperatures in the presence of oxygen, improving workability and applicability in various environments, suitable for producing molded bodies and insulating films.
Implementation Method 1
a curable composition containing a compound (A) and a curing accelerator (B)... capable of starting curing at 200°C or lower in the presence of oxygen
Data Source
AI summary
Provided is a curable composition excellent in solvent solubility and curable at a low temperature in the presence of oxygen. The curable composition of the present disclosure contains a compound (A) represented by Formula (1) shown below and a curing accelerator (B). The curing accelerator (B) is one or more selected from the group consisting of: a reaction product of meta-xylylenediamine; a quaternary phosphonium salt; a phosphonium salt having a carboxy group; a 2-ethylhexanoate salt that is a thermally latent base generator and has a carboxy group; a secondary monoamine; an imidazole-based compound; and a low-molecular-weight maleimide.