Curable Composition for Structural Bonding Thermal Strain

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Solution Overview

Problem

Current adhesive compositions struggle to achieve a balance between high strength, rigidity, and flexibility necessary for structural bonding of dissimilar materials like steel, aluminum, and fiber-reinforced composites, particularly in addressing thermal strain due to differing linear expansion coefficients.

Innovation Solution

A multi-pack curable composition comprising a polyoxyalkylene polymer with trifunctional reactive silicon groups, a (meth)acrylate ester polymer, and an epoxy resin curing agent with a tertiary amine, optimized in weight ratios and monomer compositions to produce a cured product with high Young's modulus and elongation at break, ensuring flexibility and strength.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If an epoxy resin with high rigidity is used as adhesive, then bonding strength is improved, but flexibility to follow thermal strain deteriorates

Engineering Contradiction:
Improveadhesive strengthVSAvoidflexibility to follow thermal strain
Core Design Contradiction:
StrengthVSAdaptability or versatility

Solution Approach 1:

The invention uses a composite adhesive system combining epoxy resin with reactive silicon group-containing polymers (polyoxyalkylene polymer and (meth)acrylate ester polymer). This composite formulation achieves both high bonding strength from the epoxy resin and flexibility to accommodate thermal strain from the polymer components, resolving the contradiction between strength and adaptability.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The invention modifies the chemical composition parameters of the adhesive by incorporating specific ratios of epoxy resin, polyoxyalkylene polymer with reactive silicon groups, and (meth)acrylate ester polymer. By adjusting these compositional parameters, the adhesive achieves optimal balance between rigidity (for strength) and flexibility (for thermal strain accommodation).

Inventive Principle:
Principle #35Parameter changes

2Adaptability or versatility

If a reactive silicon group-containing polyoxyalkylene polymer is used to improve flexibility, then flexibility is improved, but bonding strength deteriorates

Engineering Contradiction:
ImproveflexibilityVSAvoidbonding strength
Core Design Contradiction:
Adaptability or versatilityVSStrength

Solution Approach 1:

The invention merges three distinct components: epoxy resin (for strength), polyoxyalkylene polymer with reactive silicon groups (for flexibility and adhesion), and (meth)acrylate ester polymer (for enhanced mechanical properties). The synergistic combination of these components resolves the contradiction by allowing each component to contribute its advantageous properties without compromising the others.

Inventive Principle:
Principle #5Merging (Combining)

3Strength

If polyoxyalkylene polymer with multiple reactive silicon groups at one terminal is used, then strength is improved, but obtaining cured product with both high rigidity and flexibility becomes difficult

Engineering Contradiction:
Improvebonding strengthVSAvoiddifficulty to obtain cured product with both high rigidity and flexibility
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The invention distributes different functional properties to different components: the polyoxyalkylene polymer with multiple reactive silicon groups provides localized strength enhancement at bonding interfaces, while the (meth)acrylate ester polymer and epoxy resin matrix provide the overall rigidity and flexibility balance. This local quality assignment simplifies achieving the dual properties of rigidity and flexibility.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition provides a cured product with enhanced adhesive strength, rigidity, and flexibility, effectively addressing thermal strain issues by maintaining high Young's modulus and elongation at break, making it suitable for structural bonding of dissimilar materials.

Implementation Method 1

a reactive silicon group represented by a general formula (1)... -SiX3 (where X represents a hydroxyl group or a hydrolyzable group)

Methodology Applied
Scientific EffectHydrolysis: Hydrolysis

Implementation Method 2

a silanol condensation catalyst (E)... B agent containing an epoxy resin (C) and a silanol condensation catalyst (E)

Methodology Applied
Scientific EffectCondensation: Condensation

Implementation Method 3

an epoxy resin curing agent (D) having a tertiary amine... B agent containing an epoxy resin (C)

Methodology Applied
Scientific EffectCuring reaction: Chemical Bonding

Data Source

PatentEP3757149B1Curable composition
Publication Date: 2022.04.06 KANEKA CORP
  • EP3757149B1 patent drawing
  • EP3757149B1 patent drawing
  • EP3757149B1 patent drawing

AI summary

Provided is a curable composition in which a cured product after curing has high strength, high rigidity, and flexibility, and a cured product obtained by curing the curable composition. A multi-pack curable composition including an A agent containing a polyoxyalkylene polymer (A) having a trifunctional reactive silicon group, a (meth)acrylate ester polymer (B) having a trifunctional reactive silicon group, and an epoxy resin curing agent (D) having a tertiary amine, and a B agent containing an epoxy resin (C) and a silanol condensation catalyst (E), in which a weight ratio of (A):(B) is 95:5 to 50:50, a weight ratio of a total of (A) and (B):(C) is 90:10 to 50:50, and (B) contains a polymer containing 40% by weight or more of alkyl (meth)acrylate having 1 to 3 alkyl carbon atoms in a total monomer.