Curable Composition Using Encapsulated Peroxide for Rapid Curing
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Solution Overview
Problem
Conventional acrylic curable compositions face limitations in achieving high durability, moisture resistance, heat resistance, impact resistance, low stress properties, and high toughness, particularly in bonding large objects with gaps, and require improved curing rates and storage stability for industrial applications.
Innovation Solution
A curable composition comprising organic peroxide encapsulated in microcapsules, an accelerator, monofunctional and multifunctional (meth)acrylates, with optional elastomers, core-shell graft polymers, and inorganic fillers, which allows for efficient curing by compression and provides enhanced bonding properties and storage stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If two-part type acrylic adhesive is used to achieve high bonding strength and versatility, then adhesive performance is improved, but device complexity and ease of operation deteriorate due to required mixing steps and multiple components
Solution Approach 1:
The patent combines the curing initiator and accelerator into a single one-component system with encapsulated curing agents. The microcapsules contain the curing initiator that is released upon application, eliminating the need for separate mixing of two components while maintaining the bonding strength and versatility of two-part systems.
Solution Approach 2:
The patent uses microcapsules as an intermediary carrier to contain and control the release of the curing initiator. This intermediary structure allows the curing agent to remain stable during storage and only become active when the capsule is broken during application, simplifying the system while preserving performance.
2Strength
If two-part type acrylic adhesive is used to achieve high reactive conductivity and bonding performance, then adhesive strength is improved, but ease of operation worsens due to requirement of accurate weighing and mixing
Solution Approach 1:
The patent merges all necessary components (acrylic monomer, accelerator, and encapsulated curing initiator) into a single adhesive composition. This eliminates the need for accurate weighing and mixing of separate components, making the adhesive as easy to handle as one-part systems while maintaining the high bonding strength of two-part systems.
Solution Approach 2:
The curing initiator is pre-encapsulated in microcapsules and incorporated into the adhesive composition during manufacturing. This preliminary preparation ensures that the curing agent is ready for immediate use upon application, eliminating the need for on-site mixing and weighing operations.
3Device complexity
If heat curing type one-liquid adhesive is used to simplify the system, then device complexity is reduced, but use of energy and productivity worsen due to requirement of heating apparatus and longer aging time
Solution Approach 1:
The patent replaces the thermal energy system (heating apparatus) with a chemical energy system. The encapsulated curing initiator undergoes chemical reaction with the acrylic monomer at room temperature, eliminating the need for external heating and reducing energy consumption while maintaining one-liquid system simplicity.
Solution Approach 2:
The patent changes the curing mechanism from thermal activation to chemical activation at room temperature. By using encapsulated organic peroxide that decomposes at ambient conditions, the system achieves curing without external heating, reducing energy use and accelerating the curing process compared to heat-curing systems.
4Use of energy by moving object
If photocuring type one-liquid adhesive is used to simplify the system and reduce energy use, then use of energy is reduced, but adaptability worsens due to restriction on objects that must transmit light
Solution Approach 1:
The patent changes the activation mechanism from optical (light-based) to chemical (room temperature decomposition). The encapsulated organic peroxide cures the adhesive through chemical reaction without requiring light transmission, thereby expanding adaptability to include opaque and non-transparent materials while maintaining low energy consumption.
Solution Approach 2:
The patent replaces the optical system (light sources and light transmission requirements) with a chemical system that operates at room temperature. This substitution eliminates the restriction on light-transmitting materials while keeping energy use low, significantly improving application versatility.
5Ease of manufacture
If conventional acrylic adhesive is used to achieve basic bonding, then ease of manufacture is maintained, but reliability worsens due to insufficient durability, moisture resistance, and heat resistance
Solution Approach 1:
The patent creates a composite adhesive system combining acrylic monomer, accelerator, and encapsulated curing initiator. This composite formulation provides enhanced durability, moisture resistance, and heat resistance compared to conventional acrylic adhesives, while maintaining ease of manufacture through one-component formulation.
Solution Approach 2:
The patent changes the chemical composition and curing mechanism to achieve superior performance. By using specific acrylic monomers with appropriate functional groups and encapsulated organic peroxide, the adhesive achieves enhanced reliability in terms of durability and environmental resistance while keeping the manufacturing process simple.
6Productivity
If capsule-containing curable composition is used to improve storage stability and curing rate, then productivity is improved, but device complexity worsens due to encapsulation requirements
Solution Approach 1:
The patent uses microcapsules as an intermediary to control the release of the curing initiator. This intermediary structure enables rapid curing upon application while maintaining stable storage conditions, improving productivity without requiring complex external control systems. The capsule technology itself is a成熟 technology that can be integrated into existing manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables rapid curing, high bonding strength, and improved storage stability, allowing for efficient assembly of objects with gaps as small as 100 μm, and reduces production costs by eliminating the need for mixing steps and specialized equipment.
Implementation Method 1
an accelerator which reacts with the organic peroxide to accelerate polymerization of monomers
Implementation Method 2
an accelerator which reacts with the organic peroxide to accelerate polymerization of monomers
Implementation Method 3
organic peroxide encapsulated in microcapsules
Implementation Method 4
compressing the curable composition between the objects to be bonded, the capsules are broken, and an encapsulated matter is released
Data Source
AI summary
Provided is a curable composition which contains: an organic peroxide encapsulated in microcapsules which further contains a plasticizer; an accelerator which reacts with the organic peroxide to accelerate polymerization; (meth)acrylate compounds which may contain a (meth)acrylate having a carboxylic group and a (meth)acrylate having an alicyclic hydrocarbon; and a multifunctional (meth)acrylate different from the (meth)acrylate having a carboxylic group. The curable composition exhibits a quick curing rate.