Curable Composition for Low-Temperature Curing and Super Heat Resistance
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Solution Overview
Problem
Engineering plastics like polyimides and PEEK have poor workability due to high melting temperatures and low solvent solubility, making melt-molding and solvent use difficult, which hinders their application in composite materials and other structures.
Innovation Solution
A curable composition containing a curable compound represented by Formula (1) and a radical polymerization initiator, allowing for low-temperature curing and forming a cured product with super heat resistance and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If engineering plastics like polyimides and PEEK are used to achieve super heat resistance and mechanical properties, then heat resistance and strength are improved, but workability deteriorates due to high melting temperature and low solvent solubility
Solution Approach 1:
The patent introduces a curable compound with specific molecular structure (Formula 1) containing arylene groups and linking groups that changes the thermal and rheological parameters of the material. This allows the material to maintain super heat resistance while achieving low-temperature curability and improved workability through controlled curing reactions
Solution Approach 2:
The patent creates a composite system by combining the curable compound (Formula 1) with a radical polymerization initiator and optional modifiers (Formula 2-4). This composite approach enables the material to exhibit both the heat resistance of engineering plastics and the processability of curable resins
2Temperature
If high melting point plastics are used to achieve heat resistance, then heat resistance is improved, but melt-molding capability deteriorates
Solution Approach 1:
The patent utilizes phase transition control by designing a curable compound that transitions from a processable state (low viscosity, soluble) to a cured state (high heat resistance, flexible). The radical polymerization initiator triggers this phase transition at low temperatures, enabling easy molding before curing and superior heat resistance after curing
3Ease of manufacture
If low-temperature curing is implemented to improve workability, then workability and flexibility are improved, but storage stability may deteriorate
Solution Approach 1:
The patent incorporates a radical polymerization initiator that remains dormant during storage and only activates under specific curing conditions (heat, light, or other triggers). This preliminary preparation allows the material to maintain stability during storage while enabling low-temperature curing when needed, achieving both workability and storage stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curable composition achieves excellent workability, flexibility, and heat resistance, suitable for applications requiring super heat resistance and good dielectric properties, such as electronic devices and aerospace components.
Implementation Method 1
a curable composition containing a curable compound represented by Formula (1) and a radical polymerization initiator
Data Source
AI summary
Provided is a curable composition having excellent workability and being capable of forming a cured product having super heat resistance by curing. The curable composition of the present disclosure includes a curable compound represented by Formula (1) below and a radical polymerization initiator. In the following formula, R1 and R2 each represent a curable functional group, and D1 and D2 each represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below. Ar1 to Ar3 each represent an arylene group or a group in which two or more arylene groups are bonded via a single bond or a linking group. X represents —CO—, —S—, or —SO2—, and Y represents —S—, —SO2—, —O—, —CO—, —COO—, or —CONH—. n represents an integer of 0 or greater.