Curable Composition for Nanoimprinting with High Etching Resistance
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Solution Overview
Problem
Current photocurable compositions for nanoimprinting lack both excellent pattern forming properties and dry etching resistance, which are essential for precise and durable pattern formation on substrates.
Innovation Solution
A photocurable composition with specific ranges of polymerizable group concentration, Ohnishi parameter, ring parameter, and viscosity, including polymerizable compounds with aromatic rings and multiple functional groups, is developed to enhance both pattern forming and dry etching resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a compound having a bisaryl fluorene skeleton is contained in the range of 50 parts by mass to 95 parts by mass, then curing properties and rigidity are improved, but the composition becomes highly viscous and pattern formation is degraded
Solution Approach 1:
The patent changes the concentration parameter of the bisaryl fluorene skeleton compound from the conventional 50-95 parts by mass to a specific range of 70-90 parts by mass. This parameter optimization resolves the contradiction by achieving high curing properties while maintaining appropriate viscosity for pattern formation.
Solution Approach 2:
The patent creates a composite composition by combining the bisaryl fluorene skeleton compound with specific additives including a cyclic carbonate compound and a photopolymerization initiator. This composite approach allows the system to achieve both high curing properties and good pattern formation by balancing the properties of individual components.
2Manufacturing precision
If neopentyl glycol diacrylate is used as the compound having at least one polymerizable group, then pattern formation is achieved, but dry etching resistance is degraded
Solution Approach 1:
The patent changes the chemical structure parameter of the polymerizable compound from neopentyl glycol diacrylate to a bisaryl fluorene skeleton compound. This structural modification resolves the contradiction by providing both adequate pattern formation capability and significantly improved dry etching resistance.
Solution Approach 2:
The patent uses the bisaryl fluorene skeleton compound as a replacement that copies the essential polymerizable functions of neopentyl glycol diacrylate while improving the dry etching resistance property. The compound maintains polymerizability for pattern formation while introducing aromatic structures that enhance etching resistance.
3Manufacturing precision
If the composition is used for forming nanosized fine patterns, then manufacturing precision is improved, but the requirement for both pattern forming properties and dry etching resistance creates a trade-off
Solution Approach 1:
The patent creates a universal composition that simultaneously provides both excellent pattern forming properties and high dry etching resistance. The bisaryl fluorene skeleton compound serves multiple functions: it acts as the polymerizable matrix, provides structural rigidity for nanosized patterns, and offers inherent dry etching resistance through its aromatic structure, eliminating the need to compromise between different properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent pattern formation and high dry etching resistance, enabling precise processing of base materials with improved adhesiveness and cohesive force, reducing pattern defects and enhancing the durability of the cured films.
Implementation Method 1
a photopolymerization initiator, wherein the polymerizable compound and the photopolymerization initiator form a crosslinked network structure by photopolymerization
Implementation Method 2
the polymerizable compound and the photopolymerization initiator form a crosslinked network structure by photopolymerization, thereby providing excellent dry etching resistance
Data Source
AI summary
There is provided a curable composition for imprinting containing a polymerizable compound, in which (a) the concentration of a polymerizable group in the polymerizable compound is in the range of 4.3 mmol/g to 7.5 mmol/g, (b) a polymerizable compound X whose Ohnishi parameter is 3.5 or less and ring parameter is 0.35 or greater is contained in the range of 40% by mass to 95% by mass with respect to all the polymerizable compounds, (c) a polymerizable compound C having three or more polymerizable groups is further contained in the range of 5% by mass to 20% by mass with respect to all the polymerizable compounds, and (d) the viscosity of the composition being at 25° C. and in a state of not containing a solvent is in the range of 3 mPa·s to 8,000 mPa·s.