Curable Composition for LED Encapsulant Thermal Resistance
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Solution Overview
Problem
Current LED encapsulants lack sufficient thermal resistance, gas barrier-ability, and crack resistance, particularly at high temperatures, which affects the reliability and performance of semiconductor devices.
Innovation Solution
A curable composition comprising a mixture of linear or partially-crosslinked polyorganosiloxanes with specific siloxane units and a hydrosilylation reaction mechanism, including low- and high-refractive-index crosslinked polyorganosiloxanes, to enhance thermal resistance, gas barrier properties, and crack resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If epoxy resin is used as LED encapsulant, then adhesive property and mechanical durability are improved, but light transmittance in blue light/UV region, thermal resistance, and light resistance deteriorate
Solution Approach 1:
The invention uses a composite material system consisting of polyorganosiloxane base resin combined with specific inorganic fillers (silica, alumina, zirconia, titania) to achieve both high mechanical durability and excellent thermal resistance. The siloxane backbone provides inherent thermal stability while the inorganic fillers enhance thermal conductivity and structural strength, creating a composite that overcomes the limitations of pure epoxy resin.
Solution Approach 2:
The invention changes the chemical composition parameters by using polyorganosiloxane with specific siloxane unit ratios (D/(D+T+Q) ≥ 0.7) and controlled molecular weight (1,000-100,000), combined with precise filler content ranges (5-50 wt%). This parameter optimization achieves both high light transmittance in blue/UV regions and superior thermal resistance, resolving the contradiction between optical performance and thermal properties.
2Ease of manufacture
If conventional encapsulants are used, then manufacturing simplicity is maintained, but thermal resistance at high temperature, gas barrier-ability, and crack resistance deteriorate
Solution Approach 1:
The invention optimizes the molecular weight of polyorganosiloxane to 1,000-100,000 and controls the siloxane unit composition (D/(D+T+Q) ≥ 0.7) to achieve an balance between viscosity for easy mixing and processing, and crosslinking density for high thermal resistance and crack resistance. This parameter control enables simple manufacturing processes while achieving superior reliability.
Solution Approach 2:
The composite formulation with inorganic fillers (silica, alumina, zirconia, titania) at 5-50 wt% content enhances thermal resistance and crack resistance while maintaining gas barrier properties. The fillers create a tortuous path for gas permeation and provide thermal stability, achieving high reliability without complicating the manufacturing process.
3Strength
If high crosslinking density is achieved, then thermal resistance and strength are improved, but crack resistance and gas barrier-ability deteriorate
Solution Approach 1:
The invention precisely controls the siloxane unit composition with D/(D+T+Q) ≥ 0.7 to achieve moderate crosslinking density. This parameter optimization provides sufficient thermal resistance while maintaining network flexibility for crack resistance and appropriate free volume for gas barrier properties, resolving the contradiction between strength and reliability.
Solution Approach 2:
The invention creates local structural quality variations through the combination of linear siloxane segments (providing flexibility and crack resistance) and crosslinked regions (providing thermal resistance). The D-unit dominance ensures linear segments prevail, while controlled T/Q units provide localized crosslinking, achieving both thermal stability and mechanical flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curable composition provides a cured product with excellent processability, adhesive properties, and long-term reliability, maintaining performance and stability of semiconductor devices under high temperature conditions.
Implementation Method 1
components that can be cured by hydrosilylation, for example, a reaction between an aliphatic unsaturated bond and a hydrogen atom binding to a silicon atom
Data Source
AI summary
Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability and workability, no whitening and surface stickiness, and an excellent adhesive property. Since the curable composition has excellent thermal resistance, gas barrier-ability, and crack resistance, even when a semiconductor device to which the composition is applied is used at a high temperature for a long time, performance of the device may be stably maintained.