Curable Composition for LED Encapsulant Light Resistance
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Solution Overview
Problem
Current LED encapsulants, such as epoxy resin, lack sufficient thermal and light resistance, particularly in the low wavelength region, and exhibit stickiness and low light transmittance, which are not adequately addressed by existing solutions.
Innovation Solution
A curable composition comprising an organopolysiloxane with specific molecular structures and molar ratios of alkenyl, aryl, and epoxy groups, which forms a partially-crosslinked structure, enhancing thermal and light resistance, refractive index, and adhesive properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If epoxy resin is used as LED encapsulant, then adhesive property and mechanical durability are improved, but light transmittance in blue light or UV region and light resistance deteriorate
Solution Approach 1:
The patent uses a composite material system consisting of organopolysiloxane base resin combined with specific inorganic fillers (silica, alumina, zirconia) and fluorescent materials. This composite structure achieves both high adhesive strength and excellent light resistance in the blue/UV region, resolving the contradiction between epoxy resin's strength and its poor light transmittance.
Solution Approach 2:
The patent changes the chemical composition parameters by using organopolysiloxane with specific molecular weight (1,000-10,000) and incorporating aryl groups at controlled ratios (10-50 mol%). This parameter optimization provides both adequate adhesion and superior light resistance, overcoming epoxy resin's limitations.
2Object-affected harmful factors
If silicon resin is used to improve light and thermal resistance, then light resistance is improved, but surface stickiness occurs
Solution Approach 1:
The patent modifies the silicon resin parameters by controlling the molecular weight (1,000-10,000) and the ratio of aryl groups (10-50 mol%). This specific parameter range eliminates surface stickiness while maintaining excellent light resistance, resolving the contradiction inherent in conventional silicon resins.
Solution Approach 2:
The patent introduces local quality variations by incorporating specific functional groups (alkenyl, aryl, epoxy) at controlled positions and ratios within the organopolysiloxane structure. This localized functional distribution provides the necessary surface properties without compromising overall light resistance.
3Object-affected harmful factors
If organopolysiloxane with high aryl group content is used, then light resistance is improved, but adhesive strength deteriorates
Solution Approach 1:
The patent optimizes the aryl group content parameter within the specific range of 10-50 mol%. This parameter control ensures sufficient light resistance while maintaining adequate adhesive strength, resolving the trade-off between these two properties.
Solution Approach 2:
The patent creates a composite system where organopolysiloxane is combined with inorganic fillers and coupling agents. This composite approach distributes the functional requirements: aryl groups provide light resistance while the inorganic filler-coupling agent interface maintains adhesive strength.
4Temperature
If encapsulant with high thermal resistance is used, then thermal resistance is improved, but crack resistance deteriorates
Solution Approach 1:
The patent uses a composite material system where organopolysiloxane matrix is combined with inorganic fillers (silica, alumina, zirconia) and coupling agents. This composite structure provides thermal resistance through the inorganic components while the flexible polysiloxane matrix and coupling agents maintain crack resistance by reducing stress concentration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides an LED encapsulant with improved thermal and light resistance, crack resistance, hardness, and adhesive properties, ensuring stable durability and reliability under severe conditions without surface stickiness or whitening.
Implementation Method 1
a curable composition, comprising: (A) an organopolysiloxane having an average composition formula of Formula 1; and (B) an organopolysiloxane comprising an alkenyl group, an epoxy group and an aryl group
Implementation Method 2
As a material having excellent light and thermal resistance with respect to a low wavelength region, a silicon resin has been known
Implementation Method 3
an organopolysiloxane having an average composition formula of Formula 1; and (B) an organopolysiloxane comprising an alkenyl group, an epoxy group and an aryl group
Data Source
AI summary
This application relates to a curable composition and its use. The curable composition may exhibit excellent processibility and workability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property after curing. The curable composition may provide a cured product exhibiting stable durability and reliability under severe conditions for a long time and having no whitening and surface stickiness.