Curable Composition for LED Encapsulant
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Solution Overview
Problem
Current LED encapsulants, such as epoxy resin, suffer from low light transmittance in blue to UV wavelength regions and poor lightfastness, while silicone resin offers excellent lightfastness but lacks heat resistance and develops surface stickiness after curing, necessitating a composition that balances refractive properties, crack resistance, surface hardness, adhesive strength, and thermal shock resistance.
Innovation Solution
A curable composition comprising a polymerized product with a crosslinked organosiloxane compound and a hydrogen siloxane compound, optimized in molar ratios and molecular weights, which reacts to form a cured product with enhanced crack resistance, thermal shock resistance, and adhesive strength, preventing turbidity and surface stickiness under severe conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If epoxy resin is used as LED encapsulant, then adhesive strength and dynamic durability are improved, but light transmittance in blue to UV wavelength regions deteriorates and lightfastness becomes poor
Solution Approach 1:
The patent uses a composite material system combining organosiloxane compounds with specific silane crosslinking agents to achieve both high adhesive strength and excellent light transmittance in blue-UV regions, while maintaining superior lightfastness compared to conventional epoxy or silicone resins alone
2Duration of action of stationary object
If silicone resin is used as LED encapsulant, then lightfastness is improved, but heat resistance deteriorates and surface stickiness occurs after curing
Solution Approach 1:
The patent modifies the chemical composition parameters by incorporating specific organosiloxane structures with controlled silane content (0.1-5 wt%) and using particular crosslinking agents to achieve optimal balance between lightfastness, heat resistance, and surface properties, preventing both degradation and excessive stickiness
Solution Approach 2:
The patent introduces localized crosslinking through silane compounds at specific concentrations to enhance heat resistance and control surface properties in critical regions, while maintaining overall material homogeneity and optical performance
3Duration of action of stationary object
If silicone resin is used as LED encapsulant, then lightfastness is improved, but surface hardness and crack resistance deteriorate
Solution Approach 1:
The patent creates a composite system where organosiloxane base resin is combined with silane crosslinking agents to simultaneously achieve excellent lightfastness and enhanced crack resistance through improved mechanical strength and flexibility of the cured network
4Duration of action of stationary object
If silicone resin is used as LED encapsulant, then lightfastness is improved, but adhesive strength deteriorates
Solution Approach 1:
The patent optimizes chemical composition parameters by controlling silane content (0.1-5 wt%) and selecting specific crosslinking agents to maintain surface energy and wettability for strong adhesion, while achieving superior lightfastness through the organosiloxane structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curable composition demonstrates excellent processability, workability, and long-term reliability under high-temperature and high-moisture conditions, maintaining optical transmittance and preventing surface stickiness, thereby addressing the limitations of existing encapsulants.
Implementation Method 1
a crosslinked organosiloxane compound, which is represented by an average composition formula of Formula 2 and of which a molar ratio of an alkenyl group bound to a silicon atom with respect to the total silicon atoms ranges from 0.15 to 0.35; and (C) a hydrogen siloxane compound
Data Source
AI summary
The present application relates to a curable composition. A curable composition may be provided; which shows excellent processability and workability; which shows excellent light extraction efficiency, crack resistance, hardness, thermal shock resistance and adhesive strength after curing; and which has excellent reliability and long-term reliability under high-temperature and/or high-moisture conditions. Also, turbidity and surface stickiness may be prevented in the cured product.