Curable Composition for LED Encapsulation
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Solution Overview
Problem
Current encapsulating materials for LEDs, such as epoxy resin and silicon resin, face issues with low light transmissivity, low thermal resistance, and inadequate surface hardness, crack resistance, and adhesion strength, particularly in the blue-to-UV region, which affects the performance and longevity of LED devices.
Innovation Solution
A curable composition comprising crosslinked polysiloxanes with specific molecular structures and ratios of alkenyl, aryl, and hydrogen-bound silicon atoms, which react to form a material with improved light extraction efficiency, hardness, crack resistance, and thermal shock resistance, while maintaining processibility and workability before curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If epoxy resin is used as encapsulating material for LED, then adhesive property and dynamic durability are improved, but light transmissivity in blue-to-UV region and light resistance deteriorate
Solution Approach 1:
The patent uses a composite material system combining organometallic catalyst with organopolysiloxane components containing specific functional groups (vinyl, hydrido, epoxy, isocyanate). This composite approach allows the material to simultaneously achieve high light transmissivity in blue-to-UV region and excellent adhesive properties, resolving the contradiction between light optical properties and mechanical adhesion.
2Illumination intensity
If silicon resin is used as encapsulating material, then light resistance is improved, but thermal resistance and surface tackness deteriorate
Solution Approach 1:
The patent modifies the chemical composition parameters of polysiloxane by incorporating specific functional groups (vinyl, hydrido, epoxy, isocyanate) and using organometallic catalysts to control crosslinking density. This parameter optimization allows the material to maintain high light resistance while improving thermal resistance and controlling surface tackness through regulated curing characteristics.
3Illumination intensity
If encapsulating material with high light resistance is used, then light extraction efficiency deteriorates
Solution Approach 1:
The patent applies local quality by creating a material with spatially differentiated properties through controlled crosslinking. The organometallic catalyst enables selective crosslinking reactions that produce a network structure with local regions of varying density and functionality, allowing the material to simultaneously provide high light resistance and maintain excellent light extraction efficiency in the blue-to-UV region.
4Strength
If crosslinking density is increased to improve hardness and crack resistance, then processibility before curing deteriorates
Solution Approach 1:
The patent applies preliminary action by incorporating organometallic catalyst and functional groups into the polysiloxane structure before curing. This preliminary configuration of reactive groups and catalyst distribution enables controlled crosslinking that achieves high crack resistance while maintaining good processibility during application, as the crosslinking reaction is activated and progresses in a controlled manner after application rather than during handling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curable composition provides an encapsulating material with enhanced light transmissivity, hardness, crack resistance, and thermal shock resistance after curing, effectively addressing the limitations of existing materials and ensuring reliable performance under high temperature and humidity conditions.
Implementation Method 1
the composition may be cured by a reaction of the alkenyl groups bound to the silicon atoms in the (A) and (B) components with the hydrogen atom bound to the silicon atom in the (C) component
Data Source
AI summary
Provided is a curable composition. The curable composition, which may provide an encapsulating material, of which processibility and workability before curing are effectively maintained and which has excellent light transmissivity, light extraction efficiency, hardness, crack resistance, adhesion strength and thermal shock resistance after curing, is provided. Further, the curable composition may show effectively controlled tackiness in the surface and may not show whitening under the high temperature or high humidity condition before or after curing.


