Curable Composition for LED Encapsulant with High Refractive Index
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Solution Overview
Problem
Current LED encapsulants, such as epoxy resin and silicon resin, face challenges with low light transmittance, thermal resistance, and surface stickiness, while existing solutions do not adequately address the need for high refractivity, crack resistance, and thermal and shock resistance.
Innovation Solution
A curable composition comprising an organopolysiloxane with alkenyl and epoxy groups, and another organopolysiloxane with Si-H bonds, which forms a crosslinked structure for improved mechanical and thermal properties, and includes aryl groups for enhanced refractive index and light extraction efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If epoxy resin is used as LED encapsulant, then adhesive property and mechanical durability are improved, but light transmittance in blue/UV region and light resistance deteriorate
Solution Approach 1:
The patent uses a composite material system combining organopolysiloxane base resin with specific silane crosslinking agents and catalysts. This composite approach creates a cured product that integrates the advantages of both epoxy resin (adhesion) and silicon resin (light resistance), achieving high light transmittance in blue/UV regions while maintaining excellent adhesive properties and mechanical durability.
2Object-affected harmful factors
If silicon resin is used as LED encapsulant, then light resistance is improved, but thermal resistance increases and surface stickiness occurs
Solution Approach 1:
The patent modifies the chemical composition parameters by selecting specific organopolysiloxane structures (Formula 1 with controlled R1, R2, R3 groups) and adjusting the ratio of crosslinking agents. This parameter optimization enables the cured product to achieve high light resistance while improving thermal conductivity and eliminating surface stickiness through proper crosslinking density control.
3Ease of operation
If organopolysiloxane with alkenyl and epoxy groups is used, then processibility and workability are improved, but crack resistance and thermal shock resistance may deteriorate without proper crosslinking
Solution Approach 1:
The patent incorporates silane crosslinking agents and catalysts in advance within the organopolysiloxane composition. The silane groups are pre-positioned to react with hydroxyl groups during curing, forming a three-dimensional crosslinked network structure before the material is applied. This preliminary preparation ensures that the crosslinking reaction occurs uniformly, providing crack resistance and thermal shock resistance while maintaining the material's processibility and workability during application.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition exhibits excellent processibility, workability, light extraction efficiency, crack resistance, hardness, thermal and shock resistance, and adhesive properties, providing a stable and reliable encapsulant for LEDs with no whitening or surface stickiness.
Implementation Method 1
an organopolysiloxane with Si-H bonds, which forms a crosslinked structure for improved mechanical and thermal properties
Data Source
AI summary
Provided is a curable composition and its use. The curable composition may exhibit excellent processibility and workability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property after curing. The curable composition may provide a cured product exhibiting stable durability and reliability under severe conditions for a long time, and having no whitening and surface stickiness.