Curable Composition for LED Encapsulant Thermal Resistance

The patent employs a composite material system consisting of silicone resin as the base polymer combined with specific inorganic fillers (such as aluminum oxide, aluminum nitride, or boron nitride) to achieve both high mechanical durability and superior thermal resistance. The silicone resin matrix provides adhesive properties while the inorganic filler network enhances thermal conductivity and resistance, creating a composite encapsulant that simultaneously addresses multiple performance requirements.

The patent utilizes parameter changes by carefully controlling the molecular structure of silicone resin (including crosslinking density and polymer chain composition) and optimizing the size, shape, and distribution of inorganic filler particles. By adjusting these parameters, the material achieves high adhesive strength through chemical bonding while maintaining excellent light transmittance in the blue light and UV region through proper filler selection and dispersion control.

The patent applies local quality by creating regions with different aryl group concentrations within the polyorganosiloxane structure. Specifically, it uses a hybrid approach where certain segments or domains contain higher aryl group ratios to provide localized refractive index enhancement, while other segments maintain lower aryl content to preserve overall thermal resistance and transparency. This spatial differentiation of compositional properties allows simultaneous optimization of optical and thermal performance.